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Title: Sustaining Moore's law with 3D chips

Journal Article · · Computer
 [1];  [2];  [3];  [4];  [5]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
  2. Qualcomm, San Diego, CA (United States)
  3. Semiconductor Research Corp. (SRC), Durham, NC (United States)
  4. Georgia Inst. of Technology, Atlanta, GA (United States)
  5. International Roadmap for Devices and Systems

Here, rather than continue the expensive and time-consuming quest for transistor replacement, the authors argue that 3D chips coupled with new computer architectures can keep Moore's law on its traditional scaling path.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC04-94AL85000
OSTI ID:
1389592
Report Number(s):
SAND-2017-9177J; 656561
Journal Information:
Computer, Vol. 50, Issue 8; ISSN 0018-9162
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 14 works
Citation information provided by
Web of Science

Cited By (3)

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches journal June 2019
Ultra-thin chips for high-performance flexible electronics journal March 2018
Metrology for the next generation of semiconductor devices journal October 2018