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Title: Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation

Authors:
ORCiD logo [1]; ORCiD logo [2]; ORCiD logo [1]; ORCiD logo [3]
  1. Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts 02138, United States
  2. John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138, United States
  3. Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts 02138, United States; John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138, United States
Publication Date:
Research Org.:
Energy Frontier Research Centers (EFRC) (United States). Center for Next Generation of Materials by Design: Incorporating Metastability (CNGMD)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1388998
DOE Contract Number:  
AC36-99GO10337
Resource Type:
Journal Article
Resource Relation:
Journal Name: ACS Applied Materials and Interfaces; Journal Volume: 9; Journal Issue: 12; Related Information: CNGMD partners with National Renewable Energy Laboratory (lead); Colorado School of Mines; Harvard University; Lawrence Berkeley National Laboratory; Massachusetts Institute of Technology; Oregon State University; SLAC National Accelerator Laboratory
Country of Publication:
United States
Language:
English
Subject:
solar (photovoltaic), solar (fuels), solid state lighting, phonons, thermoelectric, hydrogen and fuel cells, defects, charge transport, optics, materials and chemistry by design, synthesis (novel materials)

Citation Formats

Feng, Jun, Gong, Xian, Lou, Xiabing, and Gordon, Roy G. Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation. United States: N. p., 2017. Web. doi:10.1021/acsami.7b01327.
Feng, Jun, Gong, Xian, Lou, Xiabing, & Gordon, Roy G. Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation. United States. doi:10.1021/acsami.7b01327.
Feng, Jun, Gong, Xian, Lou, Xiabing, and Gordon, Roy G. Thu . "Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation". United States. doi:10.1021/acsami.7b01327.
@article{osti_1388998,
title = {Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation},
author = {Feng, Jun and Gong, Xian and Lou, Xiabing and Gordon, Roy G.},
abstractNote = {},
doi = {10.1021/acsami.7b01327},
journal = {ACS Applied Materials and Interfaces},
number = 12,
volume = 9,
place = {United States},
year = {Thu Mar 16 00:00:00 EDT 2017},
month = {Thu Mar 16 00:00:00 EDT 2017}
}