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Title: Thermodynamic Stability of Low-k Amorphous SiOCH Dielectric Films

Authors:
 [1];  [2];  [1];  [3];  [1];  [1];
  1. Peter A. Rock Thermochemistry Laboratory and NEAT ORU, University of California Davis, Davis California 95616
  2. Logic Technology Development, Intel Corporation, Hillsboro Oregon 97124
  3. Peter A. Rock Thermochemistry Laboratory and NEAT ORU, University of California Davis, Davis California 95616; Department of Chemistry, N.I. Lobachevsky State University of Nizhny Novgorod, 23 Gagarin Avenue Nizhny Novgorod 603950 Russia
Publication Date:
Research Org.:
Energy Frontier Research Centers (EFRC) (United States). Fluid Interface Reactions, Structures and Transport Center (FIRST)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1388521
DOE Contract Number:  
ERKCC61
Resource Type:
Journal Article
Journal Name:
Journal of the American Ceramic Society
Additional Journal Information:
Journal Volume: 99; Journal Issue: 8; Related Information: FIRST partners with Oak Ridge National Laboratory (lead); Argonne National Laboratory; Drexel University; Georgia State University; Northwestern University; Pennsylvania State University; Suffolk University; Vanderbilt University; University of Virginia; Journal ID: ISSN 0002-7820
Publisher:
American Ceramic Society
Country of Publication:
United States
Language:
English
Subject:
catalysis (heterogeneous), solar (fuels), energy storage (including batteries and capacitors), hydrogen and fuel cells, electrodes - solar, mechanical behavior, charge transport, materials and chemistry by design, synthesis (novel materials)

Citation Formats

Chen, Jiewei, King, Sean W., Muthuswamy, Elayaraja, Koryttseva, Anastasia, Wu, Di, Navrotsky, Alexandra, and Riedel, R. Thermodynamic Stability of Low-k Amorphous SiOCH Dielectric Films. United States: N. p., 2016. Web. doi:10.1111/jace.14268.
Chen, Jiewei, King, Sean W., Muthuswamy, Elayaraja, Koryttseva, Anastasia, Wu, Di, Navrotsky, Alexandra, & Riedel, R. Thermodynamic Stability of Low-k Amorphous SiOCH Dielectric Films. United States. https://doi.org/10.1111/jace.14268
Chen, Jiewei, King, Sean W., Muthuswamy, Elayaraja, Koryttseva, Anastasia, Wu, Di, Navrotsky, Alexandra, and Riedel, R. 2016. "Thermodynamic Stability of Low-k Amorphous SiOCH Dielectric Films". United States. https://doi.org/10.1111/jace.14268.
@article{osti_1388521,
title = {Thermodynamic Stability of Low-k Amorphous SiOCH Dielectric Films},
author = {Chen, Jiewei and King, Sean W. and Muthuswamy, Elayaraja and Koryttseva, Anastasia and Wu, Di and Navrotsky, Alexandra and Riedel, R.},
abstractNote = {},
doi = {10.1111/jace.14268},
url = {https://www.osti.gov/biblio/1388521}, journal = {Journal of the American Ceramic Society},
issn = {0002-7820},
number = 8,
volume = 99,
place = {United States},
year = {Mon Apr 25 00:00:00 EDT 2016},
month = {Mon Apr 25 00:00:00 EDT 2016}
}

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