Current progress and future challenges in thermoelectric power generation: From materials to devices

Liu, Weishu; Jie, Qing; Kim, Hee Seok; Ren, Zhifeng

doi:10.1016/j.actamat.2014.12.042

Title: Current progress and future challenges in thermoelectric power generation: From materials to devices

Journal Article · Sat Jan 31 00:00:00 EST 2015 · Acta Materialia

DOI:https://doi.org/10.1016/j.actamat.2014.12.042· OSTI ID:1387171

Liu, Weishu ^[1]; Jie, Qing ^[1]; Kim, Hee Seok ^[1]; Ren, Zhifeng ^[1]

Univ. of Houston, TX (United States). Texas Center for Superconductivity (TcSUH)

Thermoelectric power generation (TEG) represents one of the cleanest methods of energy conversion available today. It can be used in applications ranging from the harvesting of waste heat to conversion of solar energy into useful electricity. Remarkable advances have been achieved in recent years for various thermoelectric (TE) material systems. The introduction of nanostructures is used to tune the transport of phonons, while band structure engineering allows for the tailoring of electron transport. In this overview, top-down approaches to phonon engineering, such as atomic construction of new materials, will be reviewed. Bottom-up approaches to electron engineering, such as the formation of ordered nanostructures, will also be discussed. The assembly of TEG devices is still particularly challenging, and consequently, thermal-to-electric conversion utilizing these devices has been realized only in niche applications. In this review paper, we will discuss some of the challenges that must be overcome to enable widespread use of TE devices. These include thermal stability at the material level, and reliable contact at the device level.

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Research Organization:: Energy Frontier Research Centers (EFRC) (United States). Solid-State Solar-Thermal Energy Conversion Center (S3TEC)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: SC0001299; FG02-09ER46577; SC0010831; FG02-13ER46917; DOE DE-SC0010831; EE0005806

OSTI ID:: 1387171

Alternate ID(s):: OSTI ID: 1250972

Journal Information:: Acta Materialia, Vol. 87, Issue C; Related Information: S3TEC partners with Massachusetts Institute of Technology (lead); Boston College; Oak Ridge National Laboratory; Rensselaer Polytechnic Institute; ISSN 1359-6454

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 392 works

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Spin-entropy induced thermopower and spin-blockade effect in CoO Negi, Devendra Singh; Singh, Deobrat; van Aken, Peter A. Physical Review B, Vol. 100, Issue 14 https://doi.org/10.1103/physrevb.100.144108	journal	October 2019
Flexible thermoelectric device to harvest waste heat from the laptop Salhi, Imane; Belhora, Fouad; Hajjaji, Abdelowahed The European Physical Journal Applied Physics, Vol. 79, Issue 1 https://doi.org/10.1051/epjap/2017160485	journal	May 2017
Influence of Sputtering Parameters on Structural, Electrical and Thermoelectric Properties of Mg–Si Coatings Arab Pour Yazdi, Mohammad; Martin, Nicolas; Petitot, Christian Coatings, Vol. 8, Issue 11 https://doi.org/10.3390/coatings8110380	journal	October 2018
Realizing Excellent Thermoelectric Performance of Sb ₂ Te ₃ Based Segmented Leg with a Wide Temperature Range Using One‐Step Sintering Xie, Liangjun; Qin, Haixu; Zhu, Jianbo Advanced Electronic Materials, Vol. 6, Issue 2 https://doi.org/10.1002/aelm.201901178	journal	December 2019
Global Analysis of Influence of Contacts on Heusler-Based Thermoelectric Modules Roy, G.; Van Der Rest, C.; Heymans, S. Journal of Electronic Materials, Vol. 48, Issue 9 https://doi.org/10.1007/s11664-019-07137-2	journal	April 2019
Thermoelectric Devices: A Review of Devices, Architectures, and Contact Optimization He, Ran; Schierning, Gabi; Nielsch, Kornelius Advanced Materials Technologies, Vol. 3, Issue 4 https://doi.org/10.1002/admt.201700256	journal	December 2017
New Insights into Intrinsic Point Defects in V ₂ VI ₃ Thermoelectric Materials Zhu, Tiejun; Hu, Lipeng; Zhao, Xinbing Advanced Science, Vol. 3, Issue 7 https://doi.org/10.1002/advs.201600004	journal	March 2016
Enhancing Thermoelectric Performance of PbSe by Se Vacancies Liu, Yefeng; You, Li; Wang, Chenyang Journal of Electronic Materials, Vol. 47, Issue 5 https://doi.org/10.1007/s11664-017-6040-5	journal	February 2018
The effect of nickel doping on electron and phonon transport in the n-type nanostructured thermoelectric material CoSbS Liu, Zihang; Geng, Huiyuan; Shuai, Jing Journal of Materials Chemistry C, Vol. 3, Issue 40 https://doi.org/10.1039/c5tc01560j	journal	January 2015
Effect of solder and barrier layer elements on the thermoelectric properties of Bi _0.5 Sb _1.5 Te ₃ Mi, Hong-Xing; Wu, Ming-Xing; Cao, Shen Materials Research Express, Vol. 6, Issue 10 https://doi.org/10.1088/2053-1591/ab3cd5	journal	August 2019
TEG Design for Waste Heat Recovery at an Aviation Jet Engine Nozzle Ziolkowski, Pawel; Zabrocki, Knud; Müller, Eckhard https://doi.org/10.20944/preprints201811.0062.v1	preprint	November 2018
Thermopower of the electron-doped manganese pnictide LaMnAsO Zingl, Manuel; Kraberger, Gernot J.; Aichhorn, Markus arXiv https://doi.org/10.48550/arxiv.1907.04173	text	January 2019
Compatibility between Co-Metallized PbTe Thermoelectric Legs and an Ag–Cu–In Brazing Alloy Ben-Ayoun, Dana; Sadia, Yatir; Gelbstein, Yaniv Materials, Vol. 11, Issue 1 https://doi.org/10.3390/ma11010099	journal	January 2018
Misfit Layer Compounds and Ferecrystals: Model Systems for Thermoelectric Nanocomposites Merrill, Devin; Moore, Daniel; Bauers, Sage Materials, Vol. 8, Issue 4 https://doi.org/10.3390/ma8042000	journal	April 2015

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