skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: High thermoelectric figure of merit in the Cu 3 SbSe 4 -Cu 3 SbS 4 solid solution

Authors:
; ;
Publication Date:
Research Org.:
Energy Frontier Research Centers (EFRC) (United States). Revolutionary Materials for Solid State Energy Conversion (RMSSEC)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1381174
DOE Contract Number:  
SC0001054
Resource Type:
Journal Article
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Volume: 98; Journal Issue: 26; Related Information: RMSSEC partners with Michigan State University (lead); University of California, Los Angeles; University of Michigan; Northwestern University; Oak Ridge National Laboratory; Ohio State University; Wayne State University; Journal ID: ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)
Country of Publication:
United States
Language:
English
Subject:
solar (thermal), phonons, thermal conductivity, thermoelectric, mechanical behavior, charge transport, materials and chemistry by design, synthesis (novel materials), synthesis (self-assembly), synthesis (scalable processing)

Citation Formats

Skoug, Eric J., Cain, Jeffrey D., and Morelli, Donald T. High thermoelectric figure of merit in the Cu 3 SbSe 4 -Cu 3 SbS 4 solid solution. United States: N. p., 2011. Web. doi:10.1063/1.3605246.
Skoug, Eric J., Cain, Jeffrey D., & Morelli, Donald T. High thermoelectric figure of merit in the Cu 3 SbSe 4 -Cu 3 SbS 4 solid solution. United States. doi:10.1063/1.3605246.
Skoug, Eric J., Cain, Jeffrey D., and Morelli, Donald T. Mon . "High thermoelectric figure of merit in the Cu 3 SbSe 4 -Cu 3 SbS 4 solid solution". United States. doi:10.1063/1.3605246.
@article{osti_1381174,
title = {High thermoelectric figure of merit in the Cu 3 SbSe 4 -Cu 3 SbS 4 solid solution},
author = {Skoug, Eric J. and Cain, Jeffrey D. and Morelli, Donald T.},
abstractNote = {},
doi = {10.1063/1.3605246},
journal = {Applied Physics Letters},
issn = {0003-6951},
number = 26,
volume = 98,
place = {United States},
year = {2011},
month = {6}
}

Works referenced in this record:

Improved Thermoelectric Properties of Cu-Doped Quaternary Chalcogenides of Cu 2 CdSnSe 4
journal, October 2009

  • Liu, Min-Ling; Chen, I-Wei; Huang, Fu-Qiang
  • Advanced Materials, Vol. 21, Issue 37
  • DOI: 10.1002/adma.200900409

Strain field fluctuation effects on lattice thermal conductivity of ZrNiSn-based thermoelectric compounds
journal, August 2004

  • Yang, J.; Meisner, G. P.; Chen, L.
  • Applied Physics Letters, Vol. 85, Issue 7
  • DOI: 10.1063/1.1783022

Intrinsically Minimal Thermal Conductivity in Cubic IVVI2 Semiconductors
journal, July 2008


Cu−Se Bond Network and Thermoelectric Compounds with Complex Diamondlike Structure
journal, November 2010

  • Shi, Xiaoya; Xi, Lili; Fan, Jing
  • Chemistry of Materials, Vol. 22, Issue 22
  • DOI: 10.1021/cm101589c

Thermoelectric properties of tetrahedrally bonded wide-gap stannite compounds Cu2ZnSn1−xInxSe4
journal, March 2009

  • Shi, X. Y.; Huang, F. Q.; Liu, M. L.
  • Applied Physics Letters, Vol. 94, Issue 12
  • DOI: 10.1063/1.3103604

Nanostructures in high-performance (GeTe) x (AgSbTe 2 ) 100− x thermoelectric materials
journal, May 2008