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Title: LED module with high index lens

Abstract

An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
Koninklijke Philips N.V. Eindhoven, NL (Netherlands)
Sponsoring Org.:
USDOE
OSTI Identifier:
1378946
Patent Number(s):
9,755,124
Application Number:
15/077,255
Assignee:
Koninklijke Philips N.V. NETL
DOE Contract Number:
FC26-08NT01583
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Mar 22
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING

Citation Formats

Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, and Wei, Yajun. LED module with high index lens. United States: N. p., 2017. Web.
Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, & Wei, Yajun. LED module with high index lens. United States.
Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, and Wei, Yajun. Tue . "LED module with high index lens". United States. doi:. https://www.osti.gov/servlets/purl/1378946.
@article{osti_1378946,
title = {LED module with high index lens},
author = {Bierhuizen, Serge J. and Wang, Nanze Patrick and Eng, Gregory W. and Sun, Decai and Wei, Yajun},
abstractNote = {An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Sep 05 00:00:00 EDT 2017},
month = {Tue Sep 05 00:00:00 EDT 2017}
}

Patent:

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