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Title: Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.

Abstract

Abstract not provided.

Authors:
; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1377734
Report Number(s):
SAND2016-7951C
646656
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the 18th International Conference on Metal Organic Vapor Phase Epitaxy held July 10-15, 2016 in San Diego, CA.
Country of Publication:
United States
Language:
English

Citation Formats

Creighton, James Randall, Coltrin, Michael E., and Figiel, Jeffrey J.. Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.. United States: N. p., 2016. Web.
Creighton, James Randall, Coltrin, Michael E., & Figiel, Jeffrey J.. Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.. United States.
Creighton, James Randall, Coltrin, Michael E., and Figiel, Jeffrey J.. Mon . "Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.". United States. doi:. https://www.osti.gov/servlets/purl/1377734.
@article{osti_1377734,
title = {Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.},
author = {Creighton, James Randall and Coltrin, Michael E. and Figiel, Jeffrey J.},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Aug 01 00:00:00 EDT 2016},
month = {Mon Aug 01 00:00:00 EDT 2016}
}

Conference:
Other availability
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