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Title: Mechanics of finite crack considering interfacial elasticity.


Abstract not provided.

Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
Report Number(s):
DOE Contract Number:
Resource Type:
Resource Relation:
Conference: Proposed for presentation at the ICTAM (International Congress on Theoretical and Applied Mechanics) held August 21-26, 2016 in Montreal, QC, Canada.
Country of Publication:
United States

Citation Formats

Dingreville, Remi Philippe Michel, and Juan, Pierre-Alexandre. Mechanics of finite crack considering interfacial elasticity.. United States: N. p., 2016. Web.
Dingreville, Remi Philippe Michel, & Juan, Pierre-Alexandre. Mechanics of finite crack considering interfacial elasticity.. United States.
Dingreville, Remi Philippe Michel, and Juan, Pierre-Alexandre. Mon . "Mechanics of finite crack considering interfacial elasticity.". United States. doi:.
title = {Mechanics of finite crack considering interfacial elasticity.},
author = {Dingreville, Remi Philippe Michel and Juan, Pierre-Alexandre},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Aug 01 00:00:00 EDT 2016},
month = {Mon Aug 01 00:00:00 EDT 2016}

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  • Abstract not provided.
  • Interfacial crack fields and singularities in bimaterial interfaces (i.e., grain boundaries or dissimilar materials interfaces) are considered through a general formulation for two-dimensional (2-D) anisotropic elasticity while accounting for the interfacial structure by means of an interfacial elasticity paradigm. The interfacial elasticity formulation introduces boundary conditions that are effectively equivalent to those for a weakly bounded interface. This formalism considers the 2-D crack-tip elastic fields using complex variable techniques. While the consideration of the interfacial elasticity does not affect the order of the singularity, it modifies the oscillatory effects associated with problems involving interface cracks. Constructive or destructive “interferences” aremore » directly affected by the interface structure and its elastic response. Furthermore, this general formulation provides an insight on the physical significance and the obvious coupling between the interface structure and the associated mechanical fields in the vicinity of the crack tip.« less
  • There are two main issues regarding thin film debonding. The first is the nucleation of interfacial cracks, while the second is the propagation of cracks. From a mechanical testing point of view, scratch testing primarily serves to address the former issue, while indentation testing is a method of addressing the latter. A new probing technique has been developed to test thin film mechanical properties. In the Microwedge Scratch Test (MWST), a wedge shaped diamond indenter tip is drawn along a fine line, while simultaneously being driven into the line. The authors compare microwedge scratching of Zone 1 and Zone Tmore » thin film specimens of sputtered W on SiO{sub 2}. Symptomatic of its poor mechanical properties, the Zone 1 film displays three separate crack systems. Because of its superior grain boundary strength, the Zone T film displayed only one of these--an interfacial crack system. Using bimaterial linear elastic fracture mechanics, governing equations are developed for propagating interfacial cracks, including expressions for strain energy release rate, bending strain, and mode mixity. Grain boundary fracture strength information may be deduced from the Zone 1 films, while adhesion may be inferred from the Zone T films.« less
  • Abstract not provided.