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Title: Protected electrode structures and methods

Abstract

An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer. The first release layer may have a low mean peak to valley surface roughness, which may enable the formation of a thin protective layer with a low mean peak to valley surface roughness.

Inventors:
; ;
Publication Date:
Research Org.:
Sion Power Corporation, Tucson, AZ (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1374434
Patent Number(s):
9,728,768
Application Number:
14/209,274
Assignee:
Sion Power Corporation ARPA-E
DOE Contract Number:
AR0000067
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Mar 13
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Mikhaylik, Yuriy V., Laramie, Michael G., and Kopera, John Joseph Christopher. Protected electrode structures and methods. United States: N. p., 2017. Web.
Mikhaylik, Yuriy V., Laramie, Michael G., & Kopera, John Joseph Christopher. Protected electrode structures and methods. United States.
Mikhaylik, Yuriy V., Laramie, Michael G., and Kopera, John Joseph Christopher. Tue . "Protected electrode structures and methods". United States. doi:. https://www.osti.gov/servlets/purl/1374434.
@article{osti_1374434,
title = {Protected electrode structures and methods},
author = {Mikhaylik, Yuriy V. and Laramie, Michael G. and Kopera, John Joseph Christopher},
abstractNote = {An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer. The first release layer may have a low mean peak to valley surface roughness, which may enable the formation of a thin protective layer with a low mean peak to valley surface roughness.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 08 00:00:00 EDT 2017},
month = {Tue Aug 08 00:00:00 EDT 2017}
}

Patent:

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