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Title: Encapsulation of high temperature thermoelectric modules

Patent ·
OSTI ID:1369053

A method of encapsulating a thermoelectric device and its associated thermoelectric elements in an inert atmosphere and a thermoelectric device fabricated by such method are described. These thermoelectric devices may be intended for use under conditions which would otherwise promote oxidation of the thermoelectric elements. The capsule is formed by securing a suitably-sized thin-walled strip of oxidation-resistant metal to the ceramic substrates which support the thermoelectric elements. The thin-walled metal strip is positioned to enclose the edges of the thermoelectric device and is secured to the substrates using gap-filling materials. The strip, substrates and gap-filling materials cooperatively encapsulate the thermoelectric elements and exclude oxygen and water vapor from atmospheric air so that the elements may be maintained in an inert, non-oxidizing environment.

Research Organization:
GM Global Technology Operations LLC, Detroit, MI (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0005432
Assignee:
GM Global Technology Operations LLC
Patent Number(s):
9,705,062
Application Number:
14/468,373
OSTI ID:
1369053
Resource Relation:
Patent File Date: 2014 Aug 26
Country of Publication:
United States
Language:
English

References (5)

Thermoelectric module patent July 1980
Apparatus And Method For Thermal Stabilization Of Pcb-Mounted Electronic Components Within An Enclosed Housing patent-application June 2008
Formation Of Glass-Based Seals Using Focused Infrared Radiation patent-application January 2014
Solar Thermoelectric Generator With Integrated Selective Wavelength Absorber patent-application June 2015
Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems journal July 2010