Modular HPC I/O characterization with Darshan
Contemporary high-performance computing (HPC) applications encompass a broad range of distinct I/O strategies and are often executed on a number of different compute platforms in their lifetime. These large-scale HPC platforms employ increasingly complex I/O subsystems to provide a suitable level of I/O performance to applications. Tuning I/O workloads for such a system is nontrivial, and the results generally are not portable to other HPC systems. I/O profiling tools can help to address this challenge, but most existing tools only instrument specific components within the I/O subsystem that provide a limited perspective on I/O performance. The increasing diversity of scientific applications and computing platforms calls for greater flexibililty and scope in I/O characterization.
- Research Organization:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Organization:
- USDOE Office of Science - Office of Advanced Scientific Computing Research; USDOE Office of Science - National Energy Research Scientific Computing Center (NERSC)
- DOE Contract Number:
- AC02-06CH11357
- OSTI ID:
- 1366455
- Resource Relation:
- Conference: 5th Workshop on Extreme-scale Programming Tools, 11/13/16 - 11/14/16, Salt Lake City, UT, US
- Country of Publication:
- United States
- Language:
- English
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