skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Tube expansion and diffusion bonding of 316L stainless steel tube-to-tube sheet joints using a commercial roller tube expander

Authors:
; ; ; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1359353
Resource Type:
Journal Article: Publisher's Accepted Manuscript
Journal Name:
Journal of Materials Processing Technology
Additional Journal Information:
Journal Volume: 234; Journal Issue: C; Related Information: CHORUS Timestamp: 2017-10-03 21:39:53; Journal ID: ISSN 0924-0136
Publisher:
Elsevier
Country of Publication:
Switzerland
Language:
English

Citation Formats

Haneklaus, Nils, Reuven, Rony, Cionea, Cristian, Hosemann, Peter, and Peterson, Per F. Tube expansion and diffusion bonding of 316L stainless steel tube-to-tube sheet joints using a commercial roller tube expander. Switzerland: N. p., 2016. Web. doi:10.1016/j.jmatprotec.2016.03.008.
Haneklaus, Nils, Reuven, Rony, Cionea, Cristian, Hosemann, Peter, & Peterson, Per F. Tube expansion and diffusion bonding of 316L stainless steel tube-to-tube sheet joints using a commercial roller tube expander. Switzerland. doi:10.1016/j.jmatprotec.2016.03.008.
Haneklaus, Nils, Reuven, Rony, Cionea, Cristian, Hosemann, Peter, and Peterson, Per F. 2016. "Tube expansion and diffusion bonding of 316L stainless steel tube-to-tube sheet joints using a commercial roller tube expander". Switzerland. doi:10.1016/j.jmatprotec.2016.03.008.
@article{osti_1359353,
title = {Tube expansion and diffusion bonding of 316L stainless steel tube-to-tube sheet joints using a commercial roller tube expander},
author = {Haneklaus, Nils and Reuven, Rony and Cionea, Cristian and Hosemann, Peter and Peterson, Per F.},
abstractNote = {},
doi = {10.1016/j.jmatprotec.2016.03.008},
journal = {Journal of Materials Processing Technology},
number = C,
volume = 234,
place = {Switzerland},
year = 2016,
month = 8
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record at 10.1016/j.jmatprotec.2016.03.008

Citation Metrics:
Cited by: 3works
Citation information provided by
Web of Science

Save / Share:
  • In the present work, plates of stainless steel (grade 410) were joined to copper ones through a diffusion bonding process using a nickel interlayer at a temperature range of 800-950 deg. C. The bonding was performed through pressing the specimens under a 12-MPa compression load and a vacuum of 10{sup -4} torr for 60 min. The results indicated the formation of distinct diffusion zones at both Cu/Ni and Ni/SS interfaces during the diffusion bonding process. The thickness of the reaction layer in both interfaces was increased by raising the processing temperature. The phase constitutions and their related microstructure at themore » Cu/Ni and Ni/SS diffusion bonding interfaces were studied using optical microscopy, scanning electron microscopy, X-ray diffraction and elemental analyses through energy dispersive spectrometry. The resulted penetration profiles were examined using a calibrated electron probe micro-analyzer. The diffusion transition regions near the Cu/Ni and Ni/SS interfaces consist of a complete solid solution zone and of various phases based on (Fe, Ni), (Fe, Cr, Ni) and (Fe, Cr) chemical systems, respectively. The diffusion-bonded joint processed at 900 deg. C showed the maximum shear strength of about 145 MPa. The maximum hardness was obtained at the SS-Ni interface with a value of about 432 HV.« less
  • By using Nb/Cu/Ni structure as multi-interlayer, diffusion bonding titanium to austenitic stainless steel has been conducted. The effects of bonding temperature and bonding time on the interfacial microstructure were analyzed by scanning electron microscope equipped with energy dispersive spectroscope, and the joint strength was evaluated by tensile test. The results showed that Ni atoms aggregated at the Cu-Nb interface, which promoted Cu solution in Nb. This phenomenon forms a Cu-Nb solution strengthening effect. However, such effect would decay by using long bonding time that dilutes Ni atom aggregation, or be suppressed by using high bonding temperature that embrittles the Cu-Nbmore » interface due to the formation of large grown intermetallic compounds. The sound joint was obtained by promoted parameters as 850 Degree-Sign C for 30-45 min, under which a bonding strength around 300 MPa could be obtained. - Highlights: Black-Right-Pointing-Pointer Titanium was diffusion bonded to stainless steel using Nb/Cu/Ni multi-interlayer. Black-Right-Pointing-Pointer The effects of bonding parameters on microstructure and joint strength were studied. Black-Right-Pointing-Pointer Nickel aggregation promotes Cu solution in Nb which can strengthen the joint. Black-Right-Pointing-Pointer The sound joint with strength of around 300 MPa was obtained by promoted parameters.« less
  • Multi-material processing in selective laser melting using a novel approach, by the separation of two different materials within a single dispensing coating system was investigated. 316L stainless steel and UNS C18400 Cu alloy multi-material samples were produced using selective laser melting and their interfacial characteristics were analyzed using focused ion beam, scanning electron microscopy, energy dispersive spectroscopy and electron back scattered diffraction techniques. A substantial amount of Fe and Cu element diffusion was observed at the bond interface suggesting good metallurgical bonding. Quantitative evidence of good bonding at the interface was also obtained from the tensile tests where the fracturemore » was initiated at the copper region. Nevertheless, the tensile strength of steel/Cu SLM parts was evaluated to be 310 ± 18 MPa and the variation in microhardness values was found to be gradual along the bonding interface from the steel region (256 ± 7 HV{sub 0.1}) to the copper region (72 ± 3 HV{sub 0.1}). - Highlights: • Multi-material processing was successfully implemented and demonstrated in SLM. • Bi-metallic laminates of steel/Cu were successfully produced with the SLM process. • A substantial amount of Fe and Cu diffusion was observed at the bond interface. • Good metallurgical bonding was obtained at the interface of the steel/Cu laminates. • Highly refined microstructure was obtained due to rapid solidification in SLM.« less
  • No abstract prepared.
  • No abstract prepared.