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Title: Photovoltaic sub-cell interconnects

Abstract

Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

Inventors:
;
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1356197
Patent Number(s):
9,647,158
Application Number:
14/283,349
Assignee:
Alliance for Sustainable Energy, LLC NREL
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 May 21
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 14 SOLAR ENERGY

Citation Formats

van Hest, Marinus Franciscus Antonius Maria, and Swinger Platt, Heather Anne. Photovoltaic sub-cell interconnects. United States: N. p., 2017. Web.
van Hest, Marinus Franciscus Antonius Maria, & Swinger Platt, Heather Anne. Photovoltaic sub-cell interconnects. United States.
van Hest, Marinus Franciscus Antonius Maria, and Swinger Platt, Heather Anne. Tue . "Photovoltaic sub-cell interconnects". United States. doi:. https://www.osti.gov/servlets/purl/1356197.
@article{osti_1356197,
title = {Photovoltaic sub-cell interconnects},
author = {van Hest, Marinus Franciscus Antonius Maria and Swinger Platt, Heather Anne},
abstractNote = {Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 09 00:00:00 EDT 2017},
month = {Tue May 09 00:00:00 EDT 2017}
}

Patent:

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