Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

Patent · Tue May 09 00:00:00 EDT 2017

OSTI ID:1356196

Rogers, John A.; Nuzzo, Ralph; Kim, Hoon-sik; Brueckner, Eric; Park, Sang Il; Kim, Rak Hwan

Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

• Research Organization: Univ. of Illinois at Urbana-Champaign, IL (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: FG02-07ER46471; FG02-07ER46453
• Assignee: The Board of Trustees of the University of Illinois
• Patent Number(s): 9,647,171
• Application Number: 14/479,100
• OSTI ID: 1356196
• Resource Relation: Patent File Date: 2014 Sep 05
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING