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Title: Ceramic substrate including thin film multilayer surface conductor

Abstract

A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.

Inventors:
;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1356181
Patent Number(s):
9,648,740
Application Number:
14/502,745
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC SNL-A
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Sep 30
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Wolf, Joseph Ambrose, and Peterson, Kenneth A. Ceramic substrate including thin film multilayer surface conductor. United States: N. p., 2017. Web.
Wolf, Joseph Ambrose, & Peterson, Kenneth A. Ceramic substrate including thin film multilayer surface conductor. United States.
Wolf, Joseph Ambrose, and Peterson, Kenneth A. Tue . "Ceramic substrate including thin film multilayer surface conductor". United States. doi:. https://www.osti.gov/servlets/purl/1356181.
@article{osti_1356181,
title = {Ceramic substrate including thin film multilayer surface conductor},
author = {Wolf, Joseph Ambrose and Peterson, Kenneth A.},
abstractNote = {A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 09 00:00:00 EDT 2017},
month = {Tue May 09 00:00:00 EDT 2017}
}

Patent:

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