Biocompatible and totally disintegrable semiconducting polymer for ultrathin and ultralightweight transient electronics

Lei, Ting; Guan, Ming; Liu, Jia; Lin, Hung-Cheng; Pfattner, Raphael; Shaw, Leo; McGuire, Allister F.; Huang, Tsung-Ching; Shao, Leilai; Cheng, Kwang-Ting; Tok, Jeffrey B. -H.; Bao, Zhenan

doi:10.1073/pnas.1701478114

Title: Biocompatible and totally disintegrable semiconducting polymer for ultrathin and ultralightweight transient electronics

Journal Article · Tue May 16 00:00:00 EDT 2017 · Proceedings of the National Academy of Sciences of the United States of America

DOI:https://doi.org/10.1073/pnas.1701478114· OSTI ID:1354752

Lei, Ting ^[1]; Guan, Ming ^[2]; Liu, Jia ^[1]; Lin, Hung-Cheng ^[1]; Pfattner, Raphael ^[1];

^[1]; McGuire, Allister F. ^[3]; Huang, Tsung-Ching ^[4]; Shao, Leilai ^[5]; Cheng, Kwang-Ting ^[5]; Tok, Jeffrey B. -H. ^[1]; Bao, Zhenan ^[1]

Department of Chemical Engineering, Stanford University, Stanford, CA 94305,
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305,
Department of Chemistry, Stanford University, Stanford, CA 94305,
Hewlett Packard Labs, Palo Alto, CA 94304,
Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106

Significance Organic electronics, particularly polymers, can be synthesized and processed with low temperatures and, more importantly, have the potential to be environmentally benign candidates for electronic applications. However, there has been no report of totally decomposable polymer semiconductors. Their availability will enable low-cost and fully disintegrable transient electronics. We have developed an innovative concept based on imine chemistry that allows totally disintegrable and biocompatible semiconducting polymers. Using an ultrathin biodegradable substrate, we successfully fabricated polymer transistors and logic circuits that show high performance and are ultralightweight, but they can be fully disintegrable. Our work significantly advances organic materials to enable environmentally friendly and biointegrated electronic applications.

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Sponsoring Organization:: USDOE

Grant/Contract Number:: AC02-76SF00515

OSTI ID:: 1354752

Journal Information:: Proceedings of the National Academy of Sciences of the United States of America, Journal Name: Proceedings of the National Academy of Sciences of the United States of America Vol. 114 Journal Issue: 20; ISSN 0027-8424

Publisher:: Proceedings of the National Academy of SciencesCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 297 works

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