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Title: Prediction of recrystallization times in electroplated copper thin films

Authors:
; ; ; ; ; ; ;
Publication Date:
Research Org.:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1354487
Report Number(s):
BNL-113004-2016-JA
Journal ID: ISSN 0040-6090
DOE Contract Number:  
SC00112704
Resource Type:
Journal Article
Resource Relation:
Journal Name: Thin Solid Films; Journal Volume: 615
Country of Publication:
United States
Language:
English

Citation Formats

Treger, Mikhail, Witt, Christian, Cabral, Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C.. Prediction of recrystallization times in electroplated copper thin films. United States: N. p., 2016. Web. doi:10.1016/j.tsf.2016.06.056.
Treger, Mikhail, Witt, Christian, Cabral, Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, & Noyan, I. C.. Prediction of recrystallization times in electroplated copper thin films. United States. doi:10.1016/j.tsf.2016.06.056.
Treger, Mikhail, Witt, Christian, Cabral, Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C.. Thu . "Prediction of recrystallization times in electroplated copper thin films". United States. doi:10.1016/j.tsf.2016.06.056.
@article{osti_1354487,
title = {Prediction of recrystallization times in electroplated copper thin films},
author = {Treger, Mikhail and Witt, Christian and Cabral, Cyril and Murray, Conal and Jordan-Sweet, Jean and Rosenberg, Robert and Eisenbraun, Eric and Noyan, I. C.},
abstractNote = {},
doi = {10.1016/j.tsf.2016.06.056},
journal = {Thin Solid Films},
number = ,
volume = 615,
place = {United States},
year = {Thu Sep 01 00:00:00 EDT 2016},
month = {Thu Sep 01 00:00:00 EDT 2016}
}