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Title: Device-packaging method and apparatus for optoelectronic circuits

Abstract

An optoelectronic device package and a method for its fabrication are provided. The device package includes a lid die and an active die that is sealed or sealable to the lid die and in which one or more optical waveguides are integrally defined. The active die includes one or more active device regions, i.e. integral optoelectronic devices or etched cavities for placement of discrete optoelectronic devices. Optical waveguides terminate at active device regions so that they can be coupled to them. Slots are defined in peripheral parts of the active dies. At least some of the slots are aligned with the ends of integral optical waveguides so that optical fibers or optoelectronic devices inserted in the slots can optically couple to the waveguides.

Inventors:
; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1353067
Patent Number(s):
9,632,261
Application Number:
14/819,293
Assignee:
Sandia Corporation SNL-A
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Aug 05
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS

Citation Formats

Zortman, William A., Henry, Michael David, and Jarecki, Jr., Robert L. Device-packaging method and apparatus for optoelectronic circuits. United States: N. p., 2017. Web.
Zortman, William A., Henry, Michael David, & Jarecki, Jr., Robert L. Device-packaging method and apparatus for optoelectronic circuits. United States.
Zortman, William A., Henry, Michael David, and Jarecki, Jr., Robert L. Tue . "Device-packaging method and apparatus for optoelectronic circuits". United States. doi:. https://www.osti.gov/servlets/purl/1353067.
@article{osti_1353067,
title = {Device-packaging method and apparatus for optoelectronic circuits},
author = {Zortman, William A. and Henry, Michael David and Jarecki, Jr., Robert L.},
abstractNote = {An optoelectronic device package and a method for its fabrication are provided. The device package includes a lid die and an active die that is sealed or sealable to the lid die and in which one or more optical waveguides are integrally defined. The active die includes one or more active device regions, i.e. integral optoelectronic devices or etched cavities for placement of discrete optoelectronic devices. Optical waveguides terminate at active device regions so that they can be coupled to them. Slots are defined in peripheral parts of the active dies. At least some of the slots are aligned with the ends of integral optical waveguides so that optical fibers or optoelectronic devices inserted in the slots can optically couple to the waveguides.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 25 00:00:00 EDT 2017},
month = {Tue Apr 25 00:00:00 EDT 2017}
}

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Works referenced in this record:

Layer separation optimization in CMOS compatible multilayer optical networks
conference, May 2013

  • Jones, Adam M.; DeRose, Christopher T.; Lentine, Anthony L.
  • 2013 Optical Interconnects Conference
  • DOI: 10.1109/OIC.2013.6552924

Wafer-Level Packaging Technology for 10 Gbps TOSAs
conference, May 2005

  • Sherrer, D.W.; Brese, N.; Fisher, J.
  • Proceedings Electronic Components and Technology, 2005. ECTC '05
  • DOI: 10.1109/ECTC.2005.1441440