Solid state lighting component
Abstract
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
- Inventors:
- Publication Date:
- Research Org.:
- Cree, Inc., Durham, NC (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1351802
- Patent Number(s):
- 9,076,940
- Application Number:
- 13/971,547
- Assignee:
- Cree, Inc. (Durham, NC)
- DOE Contract Number:
- FC26-06NT42932
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Aug 20
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, and Negley, Gerald. Solid state lighting component. United States: N. p., 2015.
Web.
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, & Negley, Gerald. Solid state lighting component. United States.
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, and Negley, Gerald. 2015.
"Solid state lighting component". United States. https://www.osti.gov/servlets/purl/1351802.
@article{osti_1351802,
title = {Solid state lighting component},
author = {Yuan, Thomas and Keller, Bernd and Ibbetson, James and Tarsa, Eric and Negley, Gerald},
abstractNote = {An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.},
doi = {},
url = {https://www.osti.gov/biblio/1351802},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 07 00:00:00 EDT 2015},
month = {Tue Jul 07 00:00:00 EDT 2015}
}
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Backlight Device
patent-application, November 2008
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Solid state lighting component
patent-application, February 2009
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Solid state lighting component
patent-application, February 2009
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Solid State Lighting Devices and Methods of Manufacturing the Same
patent-application, June 2009
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Tri-Light
patent-application, August 2009
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Led lamp
patent-application, August 2009
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Power Supply System and Method for the Operation of an Electrical Load
patent-application, August 2009
- Trattler, Peter
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Solid-State Lamps with Complete Conversion in Phosphors for Rendering an Enhanced Number of Colors
patent-application, September 2009
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Vehicle Lamp
patent-application, October 2009
- Koike, Teruo
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Light Diffusion Module and a Back Light Module Using the Same
patent-application, December 2009
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Warm White Light Emitting Apparatus and Back Light Module Comprising the Same
patent-application, February 2010
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LED Cooling System
patent-application, February 2010
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Light-Emitting Module and Illumination Apparatus
patent-application, June 2010
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Light Emitting Diode Display with Tilted Peak Emission Pattern
patent-application, January 2011
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Configuration of Multiple LED Module
patent-application, April 2011
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Configuration of Multiple LED Module
patent-application, May 2012
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Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup
journal, April 2005
- Kim, Jong Kyu; Luo, Hong; Schubert, Eric Fred
- Japanese Journal of Applied Physics, Vol. 44, Issue No. 21