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Title: Current-induced surface roughness reduction in conducting thin films

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4977024· OSTI ID:1466009

Thin film surface roughness is responsible for various materials reliability problems in microelectronics and nanofabrication technologies, which requires the development of surface roughness reduction strategies. Toward this end, we report modeling results that establish the electrical surface treatment of conducting thin films as a physical processing strategy for surface roughness reduction. We develop a continuum model of surface morphological evolution that accounts for the residual stress in the film, surface diffusional anisotropy and film texture, film’s wetting of the layer that is deposited on, and surface electromigration. Supported by linear stability theory, self-consistent dynamical simulations based on the model demonstrate that the action over several hours of a sufficiently strong and properly directed electric field on a conducting thin film can reduce its surface roughness and lead to a smooth planar film surface. In conclusion, the modeling predictions are in agreement with experimental measurements on copper thin films deposited on silicon nitride layers.

Research Organization:
Univ. of Massachusetts, Amherst, MA (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
FG02-07ER46407
OSTI ID:
1466009
Alternate ID(s):
OSTI ID: 1349360
Journal Information:
Applied Physics Letters, Vol. 110, Issue 10; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 12 works
Citation information provided by
Web of Science

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  • Rossnagel, S. M.; Kuan, T. S.
  • Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 22, Issue 1 https://doi.org/10.1116/1.1642639
journal January 2004
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Cited By (2)

Optimization of electrical treatment strategy for surface roughness reduction in conducting thin films journal September 2018
Design of semiconductor surface pits for fabrication of regular arrays of quantum dots and nanorings journal January 2019

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