Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1 - Filler metal properties and the soldering process
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Soldering technology has made tremendous strides in the past half-century. Whether structural or electronic, all solder joints must provide a level of reliability that is required by the application. This Part 1 report examines the effects of filler metal properties and soldering process on joint reliability. Solder alloy composition must have the appropriate melting and mechanical properties that suit the product's assembly process(es) and use environment. The filler metal must also optimize solderability (wetting-and-spreading) to realize the proper joint geometry. Here, the soldering process also affects joint reliability. The choice of flux and thermal profile support the solderability performance of the molten filler metal to successfully fill the gap and complete the fillet.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- Grant/Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1347531
- Report Number(s):
- SAND-2017-1069J; 650891
- Journal Information:
- Welding Journal, Vol. 96; Related Information: Research Supplement; ISSN 0043-2296
- Publisher:
- American Welding SocietyCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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