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Title: Near-chip compliant layer for reducing perimeter stress during assembly process

Abstract

A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.

Inventors:
; ; ;
Publication Date:
Research Org.:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1343745
Patent Number(s):
9,570,373
Application Number:
14/963,466
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION OSTI
DOE Contract Number:  
B604142
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Dec 09
Country of Publication:
United States
Language:
English
Subject:
97 MATHEMATICS AND COMPUTING; 36 MATERIALS SCIENCE

Citation Formats

Schultz, Mark D., Takken, Todd E., Tian, Shurong, and Yao, Yuan. Near-chip compliant layer for reducing perimeter stress during assembly process. United States: N. p., 2017. Web.
Schultz, Mark D., Takken, Todd E., Tian, Shurong, & Yao, Yuan. Near-chip compliant layer for reducing perimeter stress during assembly process. United States.
Schultz, Mark D., Takken, Todd E., Tian, Shurong, and Yao, Yuan. Tue . "Near-chip compliant layer for reducing perimeter stress during assembly process". United States. doi:. https://www.osti.gov/servlets/purl/1343745.
@article{osti_1343745,
title = {Near-chip compliant layer for reducing perimeter stress during assembly process},
author = {Schultz, Mark D. and Takken, Todd E. and Tian, Shurong and Yao, Yuan},
abstractNote = {A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Feb 14 00:00:00 EST 2017},
month = {Tue Feb 14 00:00:00 EST 2017}
}

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