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Title: Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Abstract

This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

Authors:
;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1337975
Report Number(s):
SAND2015-9308C
Journal ID: ISSN 2380--4505; 608042
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Journal Volume: 2015; Journal Issue: 1; Conference: Proposed for presentation at the IMAPS 2015 - Orlando held October 26-29, 2015 in Orlando, FL.
Country of Publication:
United States
Language:
English

Citation Formats

Hamm, Randy, and Peterson, Kenneth A. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt. United States: N. p., 2015. Web. doi:10.4071/isom-2015-THP43.
Hamm, Randy, & Peterson, Kenneth A. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt. United States. doi:10.4071/isom-2015-THP43.
Hamm, Randy, and Peterson, Kenneth A. Thu . "Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt". United States. doi:10.4071/isom-2015-THP43. https://www.osti.gov/servlets/purl/1337975.
@article{osti_1337975,
title = {Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt},
author = {Hamm, Randy and Peterson, Kenneth A.},
abstractNote = {This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.},
doi = {10.4071/isom-2015-THP43},
journal = {},
issn = {2380--4505},
number = 1,
volume = 2015,
place = {United States},
year = {2015},
month = {10}
}

Conference:
Other availability
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