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Title: Thermal Mechanical Fatigue of a 56 I/O Quad-Flat Nolead (QFN) Package.

Abstract

Abstract not provided.

Authors:
;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
OSTI Identifier:
1331959
Report Number(s):
SAND2015-9398C
607898
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the SMTAI 2015 held September 28 - October 1, 2015 in Chicago, IL.
Country of Publication:
United States
Language:
English

Citation Formats

Vianco, Paul T., and Neilsen, Michael K. Thermal Mechanical Fatigue of a 56 I/O Quad-Flat Nolead (QFN) Package.. United States: N. p., 2015. Web.
Vianco, Paul T., & Neilsen, Michael K. Thermal Mechanical Fatigue of a 56 I/O Quad-Flat Nolead (QFN) Package.. United States.
Vianco, Paul T., and Neilsen, Michael K. Thu . "Thermal Mechanical Fatigue of a 56 I/O Quad-Flat Nolead (QFN) Package.". United States. https://www.osti.gov/servlets/purl/1331959.
@article{osti_1331959,
title = {Thermal Mechanical Fatigue of a 56 I/O Quad-Flat Nolead (QFN) Package.},
author = {Vianco, Paul T. and Neilsen, Michael K.},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {10}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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