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Title: Residual Stress Developed During the Cure of Thermosetting Polymers.

Abstract

Abstract not provided.

Authors:
; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1331651
Report Number(s):
SAND2015-2149C
579386
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the Adhesives and Sealants Council Spring Conference held April 20-22, 2015 in Nashville, TN, US.
Country of Publication:
United States
Language:
English

Citation Formats

Kropka, Jamie Michael, Spangler, Scott Wilmer, Stavig, Mark E., and Chambers, Robert S.. Residual Stress Developed During the Cure of Thermosetting Polymers.. United States: N. p., 2015. Web.
Kropka, Jamie Michael, Spangler, Scott Wilmer, Stavig, Mark E., & Chambers, Robert S.. Residual Stress Developed During the Cure of Thermosetting Polymers.. United States.
Kropka, Jamie Michael, Spangler, Scott Wilmer, Stavig, Mark E., and Chambers, Robert S.. Sun . "Residual Stress Developed During the Cure of Thermosetting Polymers.". United States. doi:. https://www.osti.gov/servlets/purl/1331651.
@article{osti_1331651,
title = {Residual Stress Developed During the Cure of Thermosetting Polymers.},
author = {Kropka, Jamie Michael and Spangler, Scott Wilmer and Stavig, Mark E. and Chambers, Robert S.},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Mar 01 00:00:00 EST 2015},
month = {Sun Mar 01 00:00:00 EST 2015}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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