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Title: Inelastic strain recovery of a dynamically deformed unidirectional Ag Cu eutectic alloy

Authors:
; ; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1326408
Grant/Contract Number:
FG52-09NA29463
Resource Type:
Journal Article: Publisher's Accepted Manuscript
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 113; Journal Issue: C; Related Information: CHORUS Timestamp: 2017-10-03 22:22:13; Journal ID: ISSN 1359-6454
Publisher:
Elsevier
Country of Publication:
United States
Language:
English

Citation Formats

Kingstedt, O. T., Eftink, B. P., Robertson, I. M., and Lambros, J.. Inelastic strain recovery of a dynamically deformed unidirectional Ag Cu eutectic alloy. United States: N. p., 2016. Web. doi:10.1016/j.actamat.2016.04.043.
Kingstedt, O. T., Eftink, B. P., Robertson, I. M., & Lambros, J.. Inelastic strain recovery of a dynamically deformed unidirectional Ag Cu eutectic alloy. United States. doi:10.1016/j.actamat.2016.04.043.
Kingstedt, O. T., Eftink, B. P., Robertson, I. M., and Lambros, J.. Fri . "Inelastic strain recovery of a dynamically deformed unidirectional Ag Cu eutectic alloy". United States. doi:10.1016/j.actamat.2016.04.043.
@article{osti_1326408,
title = {Inelastic strain recovery of a dynamically deformed unidirectional Ag Cu eutectic alloy},
author = {Kingstedt, O. T. and Eftink, B. P. and Robertson, I. M. and Lambros, J.},
abstractNote = {},
doi = {10.1016/j.actamat.2016.04.043},
journal = {Acta Materialia},
number = C,
volume = 113,
place = {United States},
year = {Fri Jul 01 00:00:00 EDT 2016},
month = {Fri Jul 01 00:00:00 EDT 2016}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record at 10.1016/j.actamat.2016.04.043

Citation Metrics:
Cited by: 2works
Citation information provided by
Web of Science

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  • The interaction between dislocations and semicoherent precipitates ({Omega} phase) is discussed. The investigation shows that the semicoherent precipitate is cut by dislocations during deformation. Conventional TEM and HRTEM observations demonstrate that shearing of precipitates by dislocations occurs by multiple cutting of the precipitate. A strengthening mechanism is proposed based on this observation. The general theory is not only applicable to the {Omega} precipitate in Al-Cu-Mg-Ag alloys, but also to semicoherent precipitates in other alloys.
  • The low temperature grain boundary diffusion process using RE{sub 70}Cu{sub 30} (RE = Pr, Nd) eutectic alloy powders was applied to sintered and hot-deformed Nd-Fe-B bulk magnets. Although only marginal coercivity increase was observed in sintered magnets, a substantial enhancement in coercivity was observed when the process was applied to hot-deformed anisotropic bulk magnets. Using Pr{sub 70}Cu{sub 30} eutectic alloy as a diffusion source, the coercivity was enhanced from 1.65 T to 2.56 T. The hot-deformed sample expanded along c-axis direction only after the diffusion process as RE rich intergranular layers parallel to the broad surface of the Nd{sub 2}Fe{sub 14}B are thickened inmore » the c-axis direction.« less
  • Ammonia (NH{sub 3}) in alkaline media is oxidized to NO{sub 3}{sup {minus}} at anodized Ag-Pb eutectic alloy electrodes (2.4% Ag by weight). The anodic signal is diminished for pH ca. 10, the anodic signal decreases with time because of the loss of NH{sub 3} by volatilization. The heterogeneous rate constant for oxidation of NH{sub 3} to NO{sub 3}{sup {minus}} is significantly smaller than that for oxidation of ethylamine (EA) to acetaldehyde and NH{sub 3} (k{sub app,NH{sub 3}}/k{sub app,EA}={approximately}0.2). Hence, NH{sub 3} is concluded to be a product of ethylamine oxidation at a rotated disk electrode whereas acetaldehyde and NO{sub 3}{supmore » {minus}} are the final products of the exhaustive electrolysis of ethylamine.« less
  • Solidification of eutectic Sn-Ag solder, with and without Cu{sub 6}Sn{sub 5} composite reinforcements, on copper substrates, was investigated at two different cooling rates. The size, orientation, randomness, and overall morphology of the dendritic microstructure were examined as a function of cooling rate. Cu{sub 6}Sn{sub 5} particle reinforcements were found to act as nucleation sites for dendrites, in addition to sites on the substrate/solder interface. The mechanical properties of these solders were also examined as a function of cooling rate. Solder joints with a lower load-carrying area were found to exhibit higher shear strength, but reduced ductility when compared to soldermore » joints with more load carrying area.« less