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Title: Modulus of Elasticity and Thermal Expansion Coefficient of ITO Film

Abstract

The purpose of this experiment was to determine the modulus of elasticity (E) and thermal expansion coefficient (α) of RF sputtered Indium Tin Oxide (ITO) as a function of temperature (T), and to collect ITO film stress data. In order to accomplish that goal, the Toho FLX-2320-S thin film stress measurement machine was used to collect both single stress and stress-temperature data for ITO coated fused silica and sapphire substrates. The stress measurement function of the FLX-2320-S cannot be used to calculate the elastic modulus of the film because the Stoney formula incorporates the elastic modulus of the substrate, rather than of the film itself.

Authors:
 [1];  [1]
  1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1325877
Report Number(s):
LLNL-TR-702726
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING

Citation Formats

Carter, Austin D., and Elhadj, S.. Modulus of Elasticity and Thermal Expansion Coefficient of ITO Film. United States: N. p., 2016. Web. doi:10.2172/1325877.
Carter, Austin D., & Elhadj, S.. Modulus of Elasticity and Thermal Expansion Coefficient of ITO Film. United States. https://doi.org/10.2172/1325877
Carter, Austin D., and Elhadj, S.. Fri . "Modulus of Elasticity and Thermal Expansion Coefficient of ITO Film". United States. https://doi.org/10.2172/1325877. https://www.osti.gov/servlets/purl/1325877.
@article{osti_1325877,
title = {Modulus of Elasticity and Thermal Expansion Coefficient of ITO Film},
author = {Carter, Austin D. and Elhadj, S.},
abstractNote = {The purpose of this experiment was to determine the modulus of elasticity (E) and thermal expansion coefficient (α) of RF sputtered Indium Tin Oxide (ITO) as a function of temperature (T), and to collect ITO film stress data. In order to accomplish that goal, the Toho FLX-2320-S thin film stress measurement machine was used to collect both single stress and stress-temperature data for ITO coated fused silica and sapphire substrates. The stress measurement function of the FLX-2320-S cannot be used to calculate the elastic modulus of the film because the Stoney formula incorporates the elastic modulus of the substrate, rather than of the film itself.},
doi = {10.2172/1325877},
url = {https://www.osti.gov/biblio/1325877}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {6}
}