Modulus of Elasticity and Thermal Expansion Coefficient of ITO Film
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
The purpose of this experiment was to determine the modulus of elasticity (E) and thermal expansion coefficient (α) of RF sputtered Indium Tin Oxide (ITO) as a function of temperature (T), and to collect ITO film stress data. In order to accomplish that goal, the Toho FLX-2320-S thin film stress measurement machine was used to collect both single stress and stress-temperature data for ITO coated fused silica and sapphire substrates. The stress measurement function of the FLX-2320-S cannot be used to calculate the elastic modulus of the film because the Stoney formula incorporates the elastic modulus of the substrate, rather than of the film itself.
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC52-07NA27344
- OSTI ID:
- 1325877
- Report Number(s):
- LLNL-TR-702726
- Country of Publication:
- United States
- Language:
- English
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