Decomposition of formic acid on copper, nickel, and copper-nickel alloys. II. Catalytic and temperature-programmed decomposition of formic acid on Cu/SiO/sub 2/, Cu/Al/sub 2/O/sub 3/, and Cu powder
Turnover rates for the catalytic dehydrogenation of formic acid (HCOOH) on copper/silica (Cu/SiO/sub 2/)(Cu/Al/sub 2/O/sub 3/) and Cu powder between 380 and 500K are reported. The turnover rate is independent of HCOOH partial pressure between 1.5 and 6 kPa, concentration of decomposition products, metal loading (0.33-19.2%), metal dispersion (0.03-22%), and the nature of the support. HCOOH adsorption on Cu at room temperature leads to the formation of surface formate. Its decomposition rate constant agrees with that reported for the catalytic decomposition of HCOOH on Cu, and the decomposition of HCOOH preadsorbed on Cu(110) at low coverage. 5 figures, 3 tables.