Low profile, highly configurable, current sharing paralleled wide band gap power device power module
Patent
·
OSTI ID:1303252
A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.
- Research Organization:
- Cree Fayetteville, Inc. Fayetteville, AR (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0006429
- Assignee:
- Cree Fayetteville, Inc. (Fayetteville, AR)
- Patent Number(s):
- 9,426,883
- Application Number:
- 14/609,629
- OSTI ID:
- 1303252
- Country of Publication:
- United States
- Language:
- English
Similar Records
Design and performance of the 10-kV, 5-MA pulsed-power system for the FRX-C compression experiment
Analysis of High Power IGBT Short Circuit Failures
Highly Integrated Wide Bandgap Power Module for Next Generation Plug-In Vehicles (Final Report)
Technical Report
·
1989
·
OSTI ID:6385764
Analysis of High Power IGBT Short Circuit Failures
Technical Report
·
2005
·
OSTI ID:839770
Highly Integrated Wide Bandgap Power Module for Next Generation Plug-In Vehicles (Final Report)
Technical Report
·
2021
·
OSTI ID:1772812