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Title: High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report

Abstract

Power electronics that use high-temperature devices pose a challenge for thermal management. With the devices running at higher temperatures and having a smaller footprint, the heat fluxes increase from previous power electronic designs. This project overview presents an approach to examine and design thermal management strategies through cooling technologies to keep devices within temperature limits, dissipate the heat generated by the devices and protect electrical interconnects and other components for inverter, converter, and charger applications. This analysis, validation, and demonstration intends to take a multi-scale approach over the device, module, and system levels to reduce size, weight, and cost.

Authors:
 [1]
  1. National Renewable Energy Lab. (NREL), Golden, CO (United States)
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
OSTI Identifier:
1293811
Report Number(s):
NREL/MP-5400-62784
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
33 ADVANCED PROPULSION SYSTEMS; power electronics; thermal management; inverter cooling

Citation Formats

Waye, Scot. High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report. United States: N. p., 2016. Web. doi:10.2172/1293811.
Waye, Scot. High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report. United States. doi:10.2172/1293811.
Waye, Scot. Mon . "High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report". United States. doi:10.2172/1293811. https://www.osti.gov/servlets/purl/1293811.
@article{osti_1293811,
title = {High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report},
author = {Waye, Scot},
abstractNote = {Power electronics that use high-temperature devices pose a challenge for thermal management. With the devices running at higher temperatures and having a smaller footprint, the heat fluxes increase from previous power electronic designs. This project overview presents an approach to examine and design thermal management strategies through cooling technologies to keep devices within temperature limits, dissipate the heat generated by the devices and protect electrical interconnects and other components for inverter, converter, and charger applications. This analysis, validation, and demonstration intends to take a multi-scale approach over the device, module, and system levels to reduce size, weight, and cost.},
doi = {10.2172/1293811},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Aug 01 00:00:00 EDT 2016},
month = {Mon Aug 01 00:00:00 EDT 2016}
}

Technical Report:

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