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Title: Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion

Abstract

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

Inventors:
; ; ;
Publication Date:
Research Org.:
Semprius, Inc. Durham, NC (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1288408
Patent Number(s):
9,412,727
Application Number:
13/237,375
Assignee:
Semprius, Inc. (Durham, NC) CHO
DOE Contract Number:
FG02-91ER45439
Resource Type:
Patent
Resource Relation:
Patent File Date: 2011 Sep 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE

Citation Formats

Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States: N. p., 2016. Web.
Menard, Etienne, Rogers, John A., Kim, Seok, & Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States.
Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. 2016. "Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion". United States. doi:. https://www.osti.gov/servlets/purl/1288408.
@article{osti_1288408,
title = {Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion},
author = {Menard, Etienne and Rogers, John A. and Kim, Seok and Carlson, Andrew},
abstractNote = {In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2016,
month = 8
}

Patent:

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  • The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of `soft adhesion` to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of amore » receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.« less
  • Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
  • Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
  • Provided are methods for making a device or device component by providing a multi layer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.