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Title: Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion

Abstract

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

Inventors:
; ; ;
Publication Date:
Research Org.:
Semprius, Inc. Durham, NC (United States); Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1288408
Patent Number(s):
9,412,727
Application Number:
13/237,375
Assignee:
Semprius, Inc. (Durham, NC); The Board of Trustees of the University of Illinois (Urbana, IL)
DOE Contract Number:  
FG02-91ER45439
Resource Type:
Patent
Resource Relation:
Patent File Date: 2011 Sep 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE

Citation Formats

Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States: N. p., 2016. Web.
Menard, Etienne, Rogers, John A., Kim, Seok, & Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States.
Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. 2016. "Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion". United States. https://www.osti.gov/servlets/purl/1288408.
@article{osti_1288408,
title = {Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion},
author = {Menard, Etienne and Rogers, John A. and Kim, Seok and Carlson, Andrew},
abstractNote = {In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.},
doi = {},
url = {https://www.osti.gov/biblio/1288408}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 09 00:00:00 EDT 2016},
month = {Tue Aug 09 00:00:00 EDT 2016}
}

Works referenced in this record:

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Microfabricated adhesive mimicking gecko foot-hair
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Arrays of ultrathin silicon solar microcells
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Competing Fracture in Kinetically Controlled Transfer Printing
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Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing
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Stretchable and Foldable Silicon Integrated Circuits
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