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Title: Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion

Abstract

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

Inventors:
; ; ;
Publication Date:
Research Org.:
Semprius, Inc. Durham, NC (United States); Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1288408
Patent Number(s):
9,412,727
Application Number:
13/237,375
Assignee:
Semprius, Inc. (Durham, NC); The Board of Trustees of the University of Illinois (Urbana, IL)
DOE Contract Number:  
FG02-91ER45439
Resource Type:
Patent
Resource Relation:
Patent File Date: 2011 Sep 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE

Citation Formats

Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States: N. p., 2016. Web.
Menard, Etienne, Rogers, John A., Kim, Seok, & Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States.
Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. 2016. "Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion". United States. https://www.osti.gov/servlets/purl/1288408.
@article{osti_1288408,
title = {Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion},
author = {Menard, Etienne and Rogers, John A. and Kim, Seok and Carlson, Andrew},
abstractNote = {In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.},
doi = {},
url = {https://www.osti.gov/biblio/1288408}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {8}
}

Works referenced in this record:

Transfer printing by kinetic control of adhesion to an elastomeric stamp
journal, December 2005


Microfabricated adhesive mimicking gecko foot-hair
journal, June 2003


Stamp Collapse in Soft Lithography
journal, August 2005


Broadband measurement of rate-dependent viscoelasticity at nanoscale using scanning probe microscope: Poly(dimethylsiloxane) example
journal, September 2008


Gecko-Inspired Directional and Controllable Adhesion
journal, December 2008


Optimized Structural Designs for Stretchable Silicon Integrated Circuits
journal, December 2009


Competing Fracture in Kinetically Controlled Transfer Printing
journal, December 2007


Large-scale, heterogeneous integration of nanowire arrays for image sensor circuitry
journal, August 2008


From micro to nano contacts in biological attachment devices
journal, September 2003


Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing
journal, September 2010


Stretchable and Foldable Silicon Integrated Circuits
journal, April 2008


Reversible dry micro-fibrillar adhesives with thermally controllable adhesion
journal, January 2009