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Title: Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

Abstract

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

Inventors:
; ; ; ; ;
Publication Date:
Research Org.:
Cree Fayetteville, Inc. Fayetteville, AR (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1279755
Patent Number(s):
9,407,251
Application Number:
14/100,288
Assignee:
Cree Fayetteville, Inc. (Fayetteville, AR) ARPA-E
DOE Contract Number:  
AR0000111
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Dec 09
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Passmore, Brandon, Cole, Zach, Whitaker, Bret, Barkley, Adam, McNutt, Ty, and Lostetter, Alexander. Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration. United States: N. p., 2016. Web.
Passmore, Brandon, Cole, Zach, Whitaker, Bret, Barkley, Adam, McNutt, Ty, & Lostetter, Alexander. Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration. United States.
Passmore, Brandon, Cole, Zach, Whitaker, Bret, Barkley, Adam, McNutt, Ty, and Lostetter, Alexander. Tue . "Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration". United States. doi:. https://www.osti.gov/servlets/purl/1279755.
@article{osti_1279755,
title = {Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration},
author = {Passmore, Brandon and Cole, Zach and Whitaker, Bret and Barkley, Adam and McNutt, Ty and Lostetter, Alexander},
abstractNote = {A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 02 00:00:00 EDT 2016},
month = {Tue Aug 02 00:00:00 EDT 2016}
}

Patent:

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