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Title: Connector and electronic circuit assembly for improved wet insulation resistance

Patent ·
OSTI ID:1273364
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The present invention is premised upon a connector and electronic circuit assembly (130) at least partially encased in a polymeric frame (200). The assembly including at least: a connector housing (230); at least one electrical connector (330); at least one electronic circuit component (430); and at least one barrier element (530).

Research Organization:
Dow Global Technologies LLC, Midland, MI (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FC36-07GO17054
Assignee:
Dow Global Technologies LLC (Midland, MI)
Patent Number(s):
9,398,712
Application Number:
13/821,833
OSTI ID:
1273364
Resource Relation:
Patent File Date: 2011 Sep 29
Country of Publication:
United States
Language:
English

References (16)

Group I-III-VI Semiconductors patent October 1973
Method for forming photovoltaic cells employing multinary semiconductor films patent August 1984
Photovoltaic module patent May 1989
Electrical environmental sealant and method patent September 1989
Flame retardant splicing system patent February 1992
Cable and apparatus interface environmental seal patent September 2005
Cable and apparatus interface security device patent October 2005
Framing system for solar panels patent March 2006
Method and apparatus for mounting photovoltaic modules patent September 2009
Photovoltaic integrated building component patent January 2010
Connector assembly with internal seals and manufacturing method patent February 2010
Overmolding encapsulation process and encapsulated article made therefrom patent February 2010
Electrical connector having an encapsulant to seal the connector patent May 2010
Low temperature interconnection of nanoparticles patent-application January 2005
Encapsulation of solar cells patent-application September 2006
Stabilized Photovoltaic Device and Methods for its Manufacture patent-application November 2007

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