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Title: Challenges in the Packaging of MEMS

Abstract

Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and tomore » expose these issues to new audiences from the integrated circuit packaging community.« less

Authors:
; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
12686
Report Number(s):
SAND99-2484J
TRN: AH200120%%391
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Journal Article
Journal Name:
International Journal of Microelectronics and Packaging
Additional Journal Information:
Other Information: Submitted to International Journal of Microelectronics and Packaging; PBD: 24 Sep 1999
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; MINIATURIZATION; DEGASSING; FABRICATION; FUNCTIONALS; INTEGRATED CIRCUITS; PACKAGING; STRESS RELAXATION; MATERIALS HANDLING

Citation Formats

BROWN, WILLIAM D, EATON, WILLIAM P, MALSHE, AJAY P, MILLER, WILLIAM M, O'NEAL, CHAD, and SINGH, SUSHILA B. Challenges in the Packaging of MEMS. United States: N. p., 1999. Web.
BROWN, WILLIAM D, EATON, WILLIAM P, MALSHE, AJAY P, MILLER, WILLIAM M, O'NEAL, CHAD, & SINGH, SUSHILA B. Challenges in the Packaging of MEMS. United States.
BROWN, WILLIAM D, EATON, WILLIAM P, MALSHE, AJAY P, MILLER, WILLIAM M, O'NEAL, CHAD, and SINGH, SUSHILA B. 1999. "Challenges in the Packaging of MEMS". United States. https://www.osti.gov/servlets/purl/12686.
@article{osti_12686,
title = {Challenges in the Packaging of MEMS},
author = {BROWN, WILLIAM D and EATON, WILLIAM P and MALSHE, AJAY P and MILLER, WILLIAM M and O'NEAL, CHAD and SINGH, SUSHILA B},
abstractNote = {Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.},
doi = {},
url = {https://www.osti.gov/biblio/12686}, journal = {International Journal of Microelectronics and Packaging},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {9}
}