skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure

Abstract

Thermal modeling and simulations were used to analyze the thermal profiles of a polysilicon-metal test structure generated by thermally-induced voltage alteration (TIVA), a new laser-based failure analysis technique to localize shorted interconnects. The results show that variations in TIVA thermal profiles are due mainly to preferential laser absorption in various locations in the test structure. Differences in oxide thickness also affect the local heat conduction and temperature distribution. Modeling results also show that local variation in heat conduction is less important than the absorbed laser power in determining the local temperatures since our test structure has feature sizes that are small compared to the length over which heat spreads.

Authors:
; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
12672
Report Number(s):
SAND99-2404J
Journal ID: ISSN 0021-8979; JAPIAU; TRN: AH200120%%379
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Journal Article
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Other Information: PBD: 16 Sep 1999; Journal ID: ISSN 0021-8979
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; LASER RADIATION; ENERGY ABSORPTION; TEMPERATURE DISTRIBUTION; CONNECTORS; ELECTRICAL FAULTS; DETECTION; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY; SILICON; METALS; NONDESTRUCTIVE TESTING

Citation Formats

Benson, D.A., Cole, E.I. Jr., and Tangyunyong, Paiboon. Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure. United States: N. p., 1999. Web.
Benson, D.A., Cole, E.I. Jr., & Tangyunyong, Paiboon. Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure. United States.
Benson, D.A., Cole, E.I. Jr., and Tangyunyong, Paiboon. Thu . "Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure". United States. https://www.osti.gov/servlets/purl/12672.
@article{osti_12672,
title = {Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure},
author = {Benson, D.A. and Cole, E.I. Jr. and Tangyunyong, Paiboon},
abstractNote = {Thermal modeling and simulations were used to analyze the thermal profiles of a polysilicon-metal test structure generated by thermally-induced voltage alteration (TIVA), a new laser-based failure analysis technique to localize shorted interconnects. The results show that variations in TIVA thermal profiles are due mainly to preferential laser absorption in various locations in the test structure. Differences in oxide thickness also affect the local heat conduction and temperature distribution. Modeling results also show that local variation in heat conduction is less important than the absorbed laser power in determining the local temperatures since our test structure has feature sizes that are small compared to the length over which heat spreads.},
doi = {},
journal = {Journal of Applied Physics},
issn = {0021-8979},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {9}
}