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Title: Rapid prototype extruded conductive pathways

Patent ·
OSTI ID:1258001

A process of producing electrically conductive pathways within additively manufactured parts and similar parts made by plastic extrusion nozzles. The process allows for a three-dimensional part having both conductive and non-conductive portions and allows for such parts to be manufactured in a single production step.

Research Organization:
Savannah River Site (SRS), Aiken, SC (United States). Savannah River Technology Center (SRTC)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC09-08SR22470
Assignee:
SAVANNAH RIVER NUCLEAR SOLUTIONS, LLC (Aiken, SC)
Patent Number(s):
9,373,923
Application Number:
13/675,434
OSTI ID:
1258001
Resource Relation:
Patent File Date: 2012 Nov 13
Country of Publication:
United States
Language:
English

References (13)

Concentrated Barium Titanate Colloidal Gels Prepared by Bridging Flocculation for Use in Solid Freeform Fabrication journal January 2006
Guide for electric cable insulation extrusion head patent April 1986
Conductive plastic fluid handling equipment patent April 1992
Method of filling conductive material into through holes of printed wiring board patent July 1992
Nozzle and method for extruding conductive paste into high aspect ratio openings patent July 1999
Nozzle apparatus for extruding conductive paste patent October 2000
Process for forming integrated structures using three dimensional printing techniques patent April 2002
Electrically conductive tire and apparatus and process for extruding elements which have been made conductive patent October 2005
Coated powder particles for producing three-dimensional bodies by means of a layer constituting method patent May 2010
Rapid prototyping apparatus patent March 2011
Graphite/metal foil/polymer substrate laminate for low contact resistance bipolar plate application patent-application March 2006
Storage stability of photoinitiators patent-application May 2006
Electrically conductive structure on a semiconductor substrate formed from printing patent-application March 2010

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