LTCC Thick Film Process Characterization

Girardi, M. A.; Peterson, K. A.; Vianco, P. T.

doi:10.4071/2016cicmt-wp13

Title: LTCC Thick Film Process Characterization

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Abstract

Low temperature cofired ceramic (LTCC) technology has proven itself in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high frequency applications is appealing due to its low losses, design flexibility and packaging and integration capability. Moreover, we summarize the LTCC thick film process including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on these factors: 1) Print location, 2) Print thickness, 3) Drying of tapes and panels, 4) Shrinkage upon firing, and 5) Via topography. Statistical methods were used to analyze critical process and product characteristics in the determination towards that optimization goal.

Authors:

Girardi, M. A. ^[1]; Peterson, K. A. ^[2]; Vianco, P. T. ^[2]

National Nuclear Security Administration (NNSA), Kansas City, MO (United States). Kansas City National Security Campus
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Publication Date:: Sun May 01 00:00:00 EDT 2016

Research Org.:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org.:: USDOE National Nuclear Security Administration (NNSA)

OSTI Identifier:: 1257811

Report Number(s):: SAND2016-4120J
Journal ID: ISSN 2380-4491; 639102

Grant/Contract Number:: AC04-94AL85000

Resource Type:: Journal Article: Accepted Manuscript

Journal Name:: Additional Conferences (Device Packaging, HiTec, HiTEN & CiCMT)

Additional Journal Information:: Journal Volume: 2016; Journal Issue: CICMT; Journal ID: ISSN 2380-4491

Publisher:: IMAPS

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Girardi, M. A., Peterson, K. A., and Vianco, P. T. LTCC Thick Film Process Characterization.  United States: N. p., 2016. 
        Web.  doi:10.4071/2016cicmt-wp13.

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                    Girardi, M. A., Peterson, K. A., & Vianco, P. T. LTCC Thick Film Process Characterization.  United States.  https://doi.org/10.4071/2016cicmt-wp13

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                    Girardi, M. A., Peterson, K. A., and Vianco, P. T. 2016.  
        "LTCC Thick Film Process Characterization".  United States.  https://doi.org/10.4071/2016cicmt-wp13.  https://www.osti.gov/servlets/purl/1257811.

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@article{osti_1257811,

  title        = {LTCC Thick Film Process Characterization},

  author       = {Girardi, M. A. and Peterson, K. A. and Vianco, P. T.},

  abstractNote = {Low temperature cofired ceramic (LTCC) technology has proven itself in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high frequency applications is appealing due to its low losses, design flexibility and packaging and integration capability. Moreover, we summarize the LTCC thick film process including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on these factors: 1) Print location, 2) Print thickness, 3) Drying of tapes and panels, 4) Shrinkage upon firing, and 5) Via topography. Statistical methods were used to analyze critical process and product characteristics in the determination towards that optimization goal.},

  doi          = {10.4071/2016cicmt-wp13},

  url          = {https://www.osti.gov/biblio/1257811},
  journal      = {Additional Conferences (Device Packaging, HiTec, HiTEN & CiCMT)},

  issn         = {2380-4491},

  number       = CICMT,

  volume       = 2016,

  place        = {United States},

  year         = {Sun May 01 00:00:00 EDT 2016},

  month        = {Sun May 01 00:00:00 EDT 2016}

}

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