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Title: Calibrating thermal behavior of electronics

Abstract

A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.

Inventors:
; ;
Publication Date:
Research Org.:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1255137
Patent Number(s):
9,354,126
Application Number:
13/691,145
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY) DOEEE
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Nov 30
Country of Publication:
United States
Language:
English
Subject:
97 MATHEMATICS AND COMPUTING

Citation Formats

Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D.. Calibrating thermal behavior of electronics. United States: N. p., 2016. Web.
Chainer, Timothy J., Parida, Pritish R., & Schultz, Mark D.. Calibrating thermal behavior of electronics. United States.
Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D.. Tue . "Calibrating thermal behavior of electronics". United States. doi:. https://www.osti.gov/servlets/purl/1255137.
@article{osti_1255137,
title = {Calibrating thermal behavior of electronics},
author = {Chainer, Timothy J. and Parida, Pritish R. and Schultz, Mark D.},
abstractNote = {A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 31 00:00:00 EDT 2016},
month = {Tue May 31 00:00:00 EDT 2016}
}

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Works referenced in this record:

Power consumption and efficiency of cooling in a Data Center
conference, October 2010