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Title: Release strategies for making transferable semiconductor structures, devices and device components

Patent ·
OSTI ID:1254133

Provided are methods for making a device or device component by providing a multi layer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

Research Organization:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FG02-91ER45439
Assignee:
The Board of Trustees of the University of Illinois (Urbana, IL)
Patent Number(s):
9,349,900
Application Number:
14/246,962
OSTI ID:
1254133
Resource Relation:
Patent File Date: 2014 Apr 07
Country of Publication:
United States
Language:
English

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Implantable Biomedical Devices On Bioresorbable Substrates patent-application September 2011
Release Strategies for Making Transferable Semiconductor Structures, Devices and Device Components patent-application December 2011
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Flexible and Stretchable Electronic Systems for Epidermal Electronics patent-application February 2013
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Methods and Devices for Fabricating and Assembling Printable Semiconductor Elements patent-application July 2014
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