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Title: Cooling system for electronic components

Patent ·
OSTI ID:1253346
; ; ; ;

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
B554331
Assignee:
International Business Machines Corporatoin (Armonk, NY)
Patent Number(s):
9,342,121
Application Number:
12/417,921
OSTI ID:
1253346
Resource Relation:
Patent File Date: 2009 Apr 03
Country of Publication:
United States
Language:
English

References (41)

Liquid cooled heat exchanger for electronic power supplies patent February 1977
D-I-P On island patent June 1978
Cooling arrangement for plug-in module assembly patent February 1982
Cold chassis for cooling electronic circuit components on an electronic board patent October 1990
Liquid-cooling module system for electronic circuit components patent September 1991
Cooling system for electronic modules patent October 1991
Multiple-fan microprocessor cooling through a finned heat pipe patent August 1994
Heat pipe connector and electronic apparatus and radiating fins having such connector patent March 1995
Liquid cooled heat sink for cooling electronic components patent November 1998
Method for cooling electronic devices using a flexible coolant conduit with slip on cold plates patent May 2000
Flexible cold plate having a one-piece coolant conduit and method employing same patent August 2000
Structure of heat dissipating pieces of memories patent September 2000
Memory module assembly patent May 2001
Memory module having improved heat dissipation and shielding patent October 2001
Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink patent February 2002
Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof patent September 2002
Automotive electronics heat exchanger patent October 2003
Method to compensate for stress between heat spreader and thermal interface material patent June 2004
Methods and apparatuses for transferring heat from microelectronic device modules patent May 2005
Heat dissipation device patent March 2006
Plate supplying apparatus patent September 2006
Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board patent September 2006
Memory heat sink patent December 2006
Active cooling methods and apparatus for modules patent October 2007
Interposable heat sink for adjacent memory modules patent March 2008
Method and apparatus for cooling a memory device patent July 2008
Card cage with parallel flow paths having substantially similar lengths patent November 2008
Memory module assembly including a clip for mounting a heat sink thereon patent November 2008
Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology patent December 2008
Auxiliary cooling device for memory chips patent December 2008
Memory module assembly and heat sink thereof patent March 2010
Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs) patent May 2010
Memory module assembly with heat dissipation device patent July 2010
Heat spreader for memory modules patent November 2010
Heat dissipation device for memory module patent August 2011
Memory Module Assembly Including a Clamp for Mounting Heat Sinks Thereon patent-application November 2007
Conductive Heat Transport Cooling System and Method for a Multi-Component Electronics System patent-application October 2008
System Having A Heat Transfer Apparatus patent-application January 2009
Method And Apparatus Of Water Cooling Several Parallel Circuit Cards Each Containing Several Chip Packages patent-application November 2009
Apparatus and Method of Direct Water Cooling Several Parallel Circuit Cards Each Containing Several Chip Packages patent-application February 2010
Liquid Cooling System patent-application April 2010

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