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Title: Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.


Abstract not provided.

Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
OSTI Identifier:
Report Number(s):
DOE Contract Number:
Resource Type:
Resource Relation:
Conference: Proposed for presentation at the IBSC 2015 held April 19-22, 2015 in Long Beach, CA.
Country of Publication:
United States

Citation Formats

Vianco, Paul T., and Neilsen, Michael K.. Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.. United States: N. p., 2015. Web.
Vianco, Paul T., & Neilsen, Michael K.. Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.. United States.
Vianco, Paul T., and Neilsen, Michael K.. 2015. "Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.". United States. doi:.
title = {Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.},
author = {Vianco, Paul T. and Neilsen, Michael K.},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2015,
month = 4

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  • Abstract not provided.
  • No abstract prepared.
  • Computational modeling has been performed to determine optimum operational parameters for a piston-driven molten solder jetting device used to create array interconnects for BGA applications. The device is capable of delivering a 20 x 20 array of 600-800 {mu}m diameter molten 60Sn40Pb solder droplets onto an array of copper pads and primarily consists of an electromechanically driven piston, a heated reservoir, and an orifice plate. computer simulations were performed to determine the relationship between the amplitude and the rate of piston displacement, the onset of fluid ``pinch off``, and the production of satellite droplets. Results show that stable droplets aremore » generated when the volume of the displaced fluid has a spherical diameter that is approximately equal to the orifice diameter.« less
  • The development of smaller circuit volumes in microelectronic applications, particularly Multichip Module (MCM) technology, entails deposition of minute quantities of solder, with volumes on the order of nanoliters. We propose a system for fluxless solder deposition which uses on-demand solder jetting for deposition of 200 micrometer diameter solder droplets onto aluminum pads. This work details the computational modeling performed to provide design parameters for a magneto-hydrodynamic solder jetter (MHD). A dimensionless analysis was used to relate the fluid properties, the orifice length and width, and the droplet size to the amplitude and duration of the pressure pulse. These results weremore » used as the initial inputs for the fluid dynamics model, and subsequent iterations were performed to determine the operational parameters that lead to the formation of stable, single droplets. Results show that a maximum pulse amplitude on the order of 0.5 Mdynes/cm[sup 2] is necessary to dispense molten solder from a 200 micrometer diameter orifice. The size of the droplet was found to vary linearly with the applied pressure pulse. The duration of the pulse ranged from approximately 0.6 to 0.9 milliseconds. A theoretical description of the relationship between the orifice diameter, surface tension, and `Pinch-off` time is given, and is in agreement with the results of the computational model.« less
  • The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183 C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder which is currently in development was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can bemore » predicted. This capability was applied to predict the thermomechanical response of various leadless chip carrier solder interconnects to determine the effects of variations in geometry and loading. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the effect of geometry and loading variations on leadless chip carrier solder interconnects then will be presented.« less