skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.

Abstract

Abstract not provided.

Authors:
;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
OSTI Identifier:
1248708
Report Number(s):
SAND2015-2862C
583184
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the IBSC 2015 held April 19-22, 2015 in Long Beach, CA.
Country of Publication:
United States
Language:
English

Citation Formats

Vianco, Paul T., and Neilsen, Michael K.. Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.. United States: N. p., 2015. Web.
Vianco, Paul T., & Neilsen, Michael K.. Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.. United States.
Vianco, Paul T., and Neilsen, Michael K.. Wed . "Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.". United States. doi:. https://www.osti.gov/servlets/purl/1248708.
@article{osti_1248708,
title = {Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.},
author = {Vianco, Paul T. and Neilsen, Michael K.},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Apr 01 00:00:00 EDT 2015},
month = {Wed Apr 01 00:00:00 EDT 2015}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

Save / Share: