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Title: Reliability Analysis of Pin-in-Hole Solder Joints by Computational Modeling.

Conference ·
OSTI ID:1247091

Abstract not provided.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1247091
Report Number(s):
SAND2015-2511C; 579838
Resource Relation:
Conference: Proposed for presentation at the 6th Inter. Brazing and Soldering Conf. held April 19-22, 2015 in Long Beach, CA.
Country of Publication:
United States
Language:
English