U.S. Department of EnergyOffice of Scientific and Technical Information
$In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation
Abstract
We have performed X-ray synchrotron micro-diffraction measurements to study the processes controlling the formation of hillocks and whiskers in Sn layers on Cu. The studies were done in real-time on Sn layers that were electro-deposited immediately before the X-ray measurements were started. This enabled a region of the sample to be monitored from the as-deposited state until after a hillock feature formed. In addition to measuring the grain orientation and deviatoric strain (via Laue diffraction), the X-ray fluorescence was monitored to quantify the evolution of the Sn surface morphology and the formation of intermetallic compound (IMC) at the Sn-Cu interface. The results capture the simultaneous growth of the feature and the corresponding film stress, grain orientation, and IMC formation. The observations are compared with proposed mechanisms for whisker/hillock growth and nucleation.
- Authors:
-
[4]
- Brown Univ., Providence, RI (United States)
- International Business Machines (IBM), Hopewell Junction, NY (United States)
- Northboro R&D Center, MA (United States)
- Argonne National Lab. (ANL), Argonne, IL (United States). Advanced Photon Source (APS)
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Publication Date:
- Research Org.:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- OSTI Identifier:
- 1413990
- Alternate Identifier(s):
- OSTI ID: 1241406
- Grant/Contract Number:
- AC02-06CH11357
- Resource Type:
- Journal Article: Accepted Manuscript
- Journal Name:
- Journal of Applied Physics
- Additional Journal Information:
- Journal Volume: 119; Journal Issue: 10; Journal ID: ISSN 0021-8979
- Publisher:
- American Institute of Physics (AIP)
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; Fluorescence; Strain measurement; Stress relaxation; Surface morphology; Whiskers; Synchrotrons; X-ray diffraction; Crystal structure; Crystallographic defects; X-ray fluorescence; Scanning electron microscopy; Atomic force microscopy; Compressive stress; Mechanical stress; Plasticity
Citation Formats
Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Bower, Allan F., Chason, Eric, Liu, Wenjun, Tischler, Jonathan Z., Ice, Gene E., and Xu, Ruqing. $In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation. United States: N. p., 2016.
Web. doi:10.1063/1.4942920.
Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Bower, Allan F., Chason, Eric, Liu, Wenjun, Tischler, Jonathan Z., Ice, Gene E., & Xu, Ruqing. $In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation. United States. https://doi.org/10.1063/1.4942920
Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Bower, Allan F., Chason, Eric, Liu, Wenjun, Tischler, Jonathan Z., Ice, Gene E., and Xu, Ruqing. 2016.
"$In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation". United States. https://doi.org/10.1063/1.4942920. https://www.osti.gov/servlets/purl/1413990.
@article{osti_1413990,
title = {$In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation},
author = {Pei, Fei and Jadhav, Nitin and Buchovecky, Eric and Bower, Allan F. and Chason, Eric and Liu, Wenjun and Tischler, Jonathan Z. and Ice, Gene E. and Xu, Ruqing},
abstractNote = {We have performed X-ray synchrotron micro-diffraction measurements to study the processes controlling the formation of hillocks and whiskers in Sn layers on Cu. The studies were done in real-time on Sn layers that were electro-deposited immediately before the X-ray measurements were started. This enabled a region of the sample to be monitored from the as-deposited state until after a hillock feature formed. In addition to measuring the grain orientation and deviatoric strain (via Laue diffraction), the X-ray fluorescence was monitored to quantify the evolution of the Sn surface morphology and the formation of intermetallic compound (IMC) at the Sn-Cu interface. The results capture the simultaneous growth of the feature and the corresponding film stress, grain orientation, and IMC formation. The observations are compared with proposed mechanisms for whisker/hillock growth and nucleation.},
doi = {10.1063/1.4942920},
url = {https://www.osti.gov/biblio/1413990},
journal = {Journal of Applied Physics},
issn = {0021-8979},
number = 10,
volume = 119,
place = {United States},
year = {Wed Mar 09 00:00:00 EST 2016},
month = {Wed Mar 09 00:00:00 EST 2016}
}
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Works referenced in this record:
Investigation of Sn-Cu intermetallic compounds by AFM: new aspects of the role of intermetallic compounds in whisker formation
journal, January 2005
- Wan Zhang, ; Egli, A.; Schwager, F.
- IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, Issue 1
X-ray microbeam measurements of subgrain stress distributions in polycrystalline materials
journal, June 2005
- Ice, G. E.; Larson, B. C.; Tischler, J. Z.
- Materials Science and Engineering: A, Vol. 399, Issue 1-2
Controlled positions and kinetic analysis of spontaneous tin whisker growth
journal, September 2011
- Su, Chien-Hao; Chen, Hao; Lee, Hsin-Yi
- Applied Physics Letters, Vol. 99, Issue 13
Effects of reactive diffusion on stress evolution in Cu–Sn films
journal, July 2004
- Song, J. Y.; Yu, Jin; Lee, T. Y.
- Scripta Materialia, Vol. 51, Issue 2
Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation
journal, July 2010
- Jadhav, Nitin; Buchovecky, Eric J.; Reinbold, Lucine
- IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, Issue 3
Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation
journal, January 2013
- Sarobol, Pylin; Chen, Wei-Hsun; Pedigo, Aaron E.
- Journal of Materials Research, Vol. 28, Issue 5
Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound
journal, August 2009
- Buchovecky, Eric; Jadhav, Nitin; Bower, Allan F.
- Journal of Electronic Materials, Vol. 38, Issue 12
Accelerated growth of tin whiskers
journal, May 1954
- Fisher, R. M.; Darken, L. S.; Carroll, K. G.
- Acta Metallurgica, Vol. 2, Issue 3
Spontaneous growth mechanism of tin whiskers
journal, June 1998
- Lee, B. -Z.; Lee, D. N.
- Acta Materialia, Vol. 46, Issue 10
Pressure‐Induced Growth of Metal Whiskers
journal, February 1964
- Pitt, Charles H.; Henning, Robert G.
- Journal of Applied Physics, Vol. 35, Issue 2
Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics
journal, June 2011
- Sobiech, Matthias; Krüger, Carmen; Welzel, Udo
- Journal of Materials Research, Vol. 26, Issue 12
Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction
journal, December 2003
- Choi, W. J.; Lee, T. Y.; Tu, K. N.
- Acta Materialia, Vol. 51, Issue 20
Driving force for Sn whisker growth in the system Cu–Sn
journal, July 2008
- Sobiech, M.; Welzel, U.; Mittemeijer, E. J.
- Applied Physics Letters, Vol. 93, Issue 1
Interdiffusion and reaction in bimetallic Cu-Sn thin films
journal, April 1973
- Tu, K. N.
- Acta Metallurgica, Vol. 21, Issue 4
Small-displacement monochromator for microdiffraction experiments
journal, May 2000
- Ice, Gene E.; Chung, Jin-Seok; Lowe, Walter
- Review of Scientific Instruments, Vol. 71, Issue 5
Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu
journal, September 2012
- Pei, Fei; Jadhav, Nitin; Chason, Eric
- JOM, Vol. 64, Issue 10
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model
journal, July 2009
- Vianco, P. T.; Rejent, J. A.
- Journal of Electronic Materials, Vol. 38, Issue 9
Elliptical x-ray microprobe mirrors by differential deposition
journal, July 2000
- Ice, Gene E.; Chung, Jin-Seok; Tischler, Jonathan Z.
- Review of Scientific Instruments, Vol. 71, Issue 7
Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150°C
journal, July 2007
- Ho, C. E.; Lee, A.; Subramanian, K. N.
- Applied Physics Letters, Vol. 91, Issue 2
Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization
journal, January 2005
- Chen Xu,
- IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, Issue 1
Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes
journal, April 2008
- Chason, E.; Jadhav, N.; Chan, W. L.
- Applied Physics Letters, Vol. 92, Issue 17
Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits
journal, November 2005
- Boettinger, W. J.; Johnson, C. E.; Bendersky, L. A.
- Acta Materialia, Vol. 53, Issue 19, p. 5033-5050
Whisker Growth from Tin Coatings
journal, October 2004
- Hutchinson, W. Bevis; Oliver, James; Nylén, Margareta
- Materials Science Forum, Vol. 467-470
Real-time SEM/FIB studies of whisker growth and surface modification
journal, July 2010
- Jadhav, Nitin; Buchovecky, Eric; Chason, Eric
- JOM, Vol. 62, Issue 7
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study
journal, July 2009
- Vianco, P. T.; Rejent, J. A.
- Journal of Electronic Materials, Vol. 38, Issue 9
Three-dimensional X-ray structural microscopy with submicrometre resolution
journal, February 2002
- Larson, B. C.; Yang, Wenge; Ice, G. E.
- Nature, Vol. 415, p. 887-890
Elastic Constants of Tin from 4.2°K to 300°K
journal, December 1960
- Rayne, J. A.; Chandrasekhar, B. S.
- Physical Review, Vol. 120, Issue 5
Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions
journal, January 1994
- Tu, K. N.
- Physical Review B, Vol. 49, Issue 3
Stress behavior of electroplated Sn films during thermal cycling
journal, April 2009
- Shin, Jae Wook; Chason, Eric
- Journal of Materials Research, Vol. 24, Issue 4
A synchrotron micro-diffraction investigation of crystallographic texture of high-Sn alloy films and its effects on whisker growth
conference, June 2010
- Sarobol, Pylin; Pedigo, Aaron; Blendell, John
- 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
Theory of Tin Whisker Growth: “The End Game”
journal, January 2007
- Smetana, Joe
- IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, Issue 1
Effects of Lead on Tin Whisker Elimination
journal, January 2006
- Zhang, Wan; Schwager, Felix
- Journal of The Electrochemical Society, Vol. 153, Issue 5
Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms
journal, May 2013
- Chason, Eric; Jadhav, Nitin; Pei, Fei
- Progress in Surface Science, Vol. 88, Issue 2
Automated indexing for texture and strain measurement with broad-bandpass x-ray microbeams
journal, November 1999
- Chung, Jin-Seok; Ice, Gene E.
- Journal of Applied Physics, Vol. 86, Issue 9
Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin Films
journal, May 2015
- Vianco, P. T.; Neilsen, M. K.; Rejent, J. A.
- Journal of Electronic Materials, Vol. 44, Issue 10
Local, submicron, strain gradients as the cause of Sn whisker growth
journal, June 2009
- Sobiech, M.; Wohlschlögel, M.; Welzel, U.
- Applied Physics Letters, Vol. 94, Issue 22
Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders
journal, September 2005
- Moon, K. -W.; Johnson, C. E.; Williams, M. E.
- Journal of Electronic Materials, Vol. 34, Issue 9
Works referencing / citing this record:
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journal, September 2019
- Chang, Ge; Liu, Shijun; Fu, Yanan
- Advanced Materials Interfaces, Vol. 6, Issue 23
Chemo-thermo-mechanically Coupled Crystal Plasticity Simulation of Stress Evolution in Thermally Strained β-Sn Films
journal, October 2018
- Chakraborty, Aritra; Eisenlohr, Philip
- Journal of Electronic Materials, Vol. 48, Issue 1
Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn Whisker Growth
journal, June 2019
- Lin, Wen-Chih; Tseng, Tsan-Hsien; Liu, Wei
- JOM, Vol. 71, Issue 9
A full-field crystal plasticity study on how texture and grain structure influences hydrostatic stress in thermally strained β -Sn films
journal, July 2018
- Chakraborty, Aritra; Eisenlohr, Philip
- Journal of Applied Physics, Vol. 124, Issue 2