$In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation

Pei, Fei; Jadhav, Nitin; Buchovecky, Eric; Bower, Allan F.; Chason, Eric; Liu, Wenjun; Tischler, Jonathan Z.; Ice, Gene E.; Xu, Ruqing

doi:10.1063/1.4942920

Title: $In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation

Journal Article · Wed Mar 09 00:00:00 EST 2016 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.4942920· OSTI ID:1413990

Pei, Fei ^[1]; Jadhav, Nitin ^[2]; Buchovecky, Eric ^[3]; Bower, Allan F. ^[1]; Chason, Eric ^[1]; Liu, Wenjun ^[4]; Tischler, Jonathan Z. ^[4]; Ice, Gene E. ^[5];

^[4]

Brown Univ., Providence, RI (United States)
International Business Machines (IBM), Hopewell Junction, NY (United States)
Northboro R&D Center, MA (United States)
Argonne National Lab. (ANL), Argonne, IL (United States). Advanced Photon Source (APS)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

We have performed X-ray synchrotron micro-diffraction measurements to study the processes controlling the formation of hillocks and whiskers in Sn layers on Cu. The studies were done in real-time on Sn layers that were electro-deposited immediately before the X-ray measurements were started. This enabled a region of the sample to be monitored from the as-deposited state until after a hillock feature formed. In addition to measuring the grain orientation and deviatoric strain (via Laue diffraction), the X-ray fluorescence was monitored to quantify the evolution of the Sn surface morphology and the formation of intermetallic compound (IMC) at the Sn-Cu interface. The results capture the simultaneous growth of the feature and the corresponding film stress, grain orientation, and IMC formation. The observations are compared with proposed mechanisms for whisker/hillock growth and nucleation.

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Research Organization:: Argonne National Lab. (ANL), Argonne, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: AC02-06CH11357

OSTI ID:: 1413990

Alternate ID(s):: OSTI ID: 1241406

Journal Information:: Journal of Applied Physics, Vol. 119, Issue 10; ISSN 0021-8979

Publisher:: American Institute of Physics (AIP)Copyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 13 works

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References (37)

Investigation of Sn-Cu intermetallic compounds by AFM: new aspects of the role of intermetallic compounds in whisker formation IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, Issue 1 https://doi.org/10.1109/TEPM.2005.847441	journal	January 2005
X-ray microbeam measurements of subgrain stress distributions in polycrystalline materials Ice, G. E.; Larson, B. C.; Tischler, J. Z. Materials Science and Engineering: A, Vol. 399, Issue 1-2 https://doi.org/10.1016/j.msea.2005.02.035	journal	June 2005
Controlled positions and kinetic analysis of spontaneous tin whisker growth Su, Chien-Hao; Chen, Hao; Lee, Hsin-Yi Applied Physics Letters, Vol. 99, Issue 13 https://doi.org/10.1063/1.3643472	journal	September 2011
Effects of reactive diffusion on stress evolution in Cu–Sn films Song, J. Y.; Yu, Jin; Lee, T. Y. Scripta Materialia, Vol. 51, Issue 2 https://doi.org/10.1016/j.scriptamat.2004.03.032	journal	July 2004
Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation Jadhav, Nitin; Buchovecky, Eric J.; Reinbold, Lucine IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, Issue 3 https://doi.org/10.1109/TEPM.2010.2043847	journal	July 2010
Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation Sarobol, Pylin; Chen, Wei-Hsun; Pedigo, Aaron E. Journal of Materials Research, Vol. 28, Issue 5 https://doi.org/10.1557/jmr.2012.430	journal	January 2013
Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound Buchovecky, Eric; Jadhav, Nitin; Bower, Allan F. Journal of Electronic Materials, Vol. 38, Issue 12 https://doi.org/10.1007/s11664-009-0911-3	journal	August 2009
Accelerated growth of tin whiskers Fisher, R. M.; Darken, L. S.; Carroll, K. G. Acta Metallurgica, Vol. 2, Issue 3 https://doi.org/10.1016/0001-6160(54)90053-X	journal	May 1954
Spontaneous growth mechanism of tin whiskers Lee, B. -Z.; Lee, D. N. Acta Materialia, Vol. 46, Issue 10 https://doi.org/10.1016/S1359-6454(98)00045-7	journal	June 1998
Pressure‐Induced Growth of Metal Whiskers Pitt, Charles H.; Henning, Robert G. Journal of Applied Physics, Vol. 35, Issue 2 https://doi.org/10.1063/1.1713337	journal	February 1964
Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics Sobiech, Matthias; Krüger, Carmen; Welzel, Udo Journal of Materials Research, Vol. 26, Issue 12 https://doi.org/10.1557/jmr.2011.162	journal	June 2011
Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction Choi, W. J.; Lee, T. Y.; Tu, K. N. Acta Materialia, Vol. 51, Issue 20 https://doi.org/10.1016/S1359-6454(03)00448-8	journal	December 2003
Driving force for Sn whisker growth in the system Cu–Sn Sobiech, M.; Welzel, U.; Mittemeijer, E. J. Applied Physics Letters, Vol. 93, Issue 1 https://doi.org/10.1063/1.2953973	journal	July 2008
Interdiffusion and reaction in bimetallic Cu-Sn thin films Tu, K. N. Acta Metallurgica, Vol. 21, Issue 4 https://doi.org/10.1016/0001-6160(73)90190-9	journal	April 1973
Small-displacement monochromator for microdiffraction experiments Ice, Gene E.; Chung, Jin-Seok; Lowe, Walter Review of Scientific Instruments, Vol. 71, Issue 5 https://doi.org/10.1063/1.1150568	journal	May 2000
Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu Pei, Fei; Jadhav, Nitin; Chason, Eric JOM, Vol. 64, Issue 10 https://doi.org/10.1007/s11837-012-0442-x	journal	September 2012
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model Vianco, P. T.; Rejent, J. A. Journal of Electronic Materials, Vol. 38, Issue 9 https://doi.org/10.1007/s11664-009-0879-z	journal	July 2009
Elliptical x-ray microprobe mirrors by differential deposition Ice, Gene E.; Chung, Jin-Seok; Tischler, Jonathan Z. Review of Scientific Instruments, Vol. 71, Issue 7 https://doi.org/10.1063/1.1150668	journal	July 2000
Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150°C Ho, C. E.; Lee, A.; Subramanian, K. N. Applied Physics Letters, Vol. 91, Issue 2 https://doi.org/10.1063/1.2756292	journal	July 2007
Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, Issue 1 https://doi.org/10.1109/TEPM.2005.846461	journal	January 2005
Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes Chason, E.; Jadhav, N.; Chan, W. L. Applied Physics Letters, Vol. 92, Issue 17 https://doi.org/10.1063/1.2912528	journal	April 2008
Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits Boettinger, W. J.; Johnson, C. E.; Bendersky, L. A. Acta Materialia, Vol. 53, Issue 19, p. 5033-5050 https://doi.org/10.1016/j.actamat.2005.07.016	journal	November 2005
Whisker Growth from Tin Coatings Hutchinson, W. Bevis; Oliver, James; Nylén, Margareta Materials Science Forum, Vol. 467-470 https://doi.org/10.4028/www.scientific.net/MSF.467-470.465	journal	October 2004
Real-time SEM/FIB studies of whisker growth and surface modification Jadhav, Nitin; Buchovecky, Eric; Chason, Eric JOM, Vol. 62, Issue 7 https://doi.org/10.1007/s11837-010-0105-8	journal	July 2010
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study Vianco, P. T.; Rejent, J. A. Journal of Electronic Materials, Vol. 38, Issue 9 https://doi.org/10.1007/s11664-009-0882-4	journal	July 2009
Three-dimensional X-ray structural microscopy with submicrometre resolution Larson, B. C.; Yang, Wenge; Ice, G. E. Nature, Vol. 415, p. 887-890 https://doi.org/10.1038/415887a	journal	February 2002
Elastic Constants of $β$ Tin from 4.2°K to 300°K Rayne, J. A.; Chandrasekhar, B. S. Physical Review, Vol. 120, Issue 5 https://doi.org/10.1103/PhysRev.120.1658	journal	December 1960
Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions Tu, K. N. Physical Review B, Vol. 49, Issue 3 https://doi.org/10.1103/PhysRevB.49.2030	journal	January 1994
Stress behavior of electroplated Sn films during thermal cycling Shin, Jae Wook; Chason, Eric Journal of Materials Research, Vol. 24, Issue 4 https://doi.org/10.1557/jmr.2009.0172	journal	April 2009
A synchrotron micro-diffraction investigation of crystallographic texture of high-Sn alloy films and its effects on whisker growth Sarobol, Pylin; Pedigo, Aaron; Blendell, John 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) https://doi.org/10.1109/ECTC.2010.5490896	conference	June 2010
Theory of Tin Whisker Growth: “The End Game” Smetana, Joe IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, Issue 1 https://doi.org/10.1109/TEPM.2006.890645	journal	January 2007
Effects of Lead on Tin Whisker Elimination Zhang, Wan; Schwager, Felix Journal of The Electrochemical Society, Vol. 153, Issue 5 https://doi.org/10.1149/1.2186032	journal	January 2006
Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms Chason, Eric; Jadhav, Nitin; Pei, Fei Progress in Surface Science, Vol. 88, Issue 2 https://doi.org/10.1016/j.progsurf.2013.02.002	journal	May 2013
Automated indexing for texture and strain measurement with broad-bandpass x-ray microbeams Chung, Jin-Seok; Ice, Gene E. Journal of Applied Physics, Vol. 86, Issue 9 https://doi.org/10.1063/1.371507	journal	November 1999
Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin Films Vianco, P. T.; Neilsen, M. K.; Rejent, J. A. Journal of Electronic Materials, Vol. 44, Issue 10 https://doi.org/10.1007/s11664-015-3779-4	journal	May 2015
Local, submicron, strain gradients as the cause of Sn whisker growth Sobiech, M.; Wohlschlögel, M.; Welzel, U. Applied Physics Letters, Vol. 94, Issue 22 https://doi.org/10.1063/1.3147864	journal	June 2009
Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders Moon, K. -W.; Johnson, C. E.; Williams, M. E. Journal of Electronic Materials, Vol. 34, Issue 9 https://doi.org/10.1007/s11664-005-0274-3	journal	September 2005

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Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn Whisker Growth Lin, Wen-Chih; Tseng, Tsan-Hsien; Liu, Wei JOM, Vol. 71, Issue 9 https://doi.org/10.1007/s11837-019-03546-0	journal	June 2019
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Fluorescence
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Title: $In-situ$ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation

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