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Method for applying a diffusion barrier interlayer for high temperature components

Patent ·
OSTI ID:1241321
A coated substrate and a method of forming a diffusion barrier coating system between a substrate and a MCrAl coating, including a diffusion barrier coating deposited onto at least a portion of a substrate surface, wherein the diffusion barrier coating comprises a nitride, oxide or carbide of one or more transition metals and/or metalloids and a MCrAl coating, wherein M includes a transition metal or a metalloid, deposited on at least a portion of the diffusion barrier coating, wherein the diffusion barrier coating restricts the inward diffusion of aluminum of the MCrAl coating into the substrate.
Research Organization:
SOUTHWEST RESEARCH INSTITUTE, San Antonio, TX (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FC26-07NT43096
Assignee:
SOUTHWEST RESEARCH INSTITUTE (San Antonio, TX)
Patent Number(s):
9,279,187
Application Number:
12/616,599
OSTI ID:
1241321
Country of Publication:
United States
Language:
English

References (11)

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conference January 2009
TiN high temperature diffusion barrier for copper‐gasketed stainless‐steel flanges
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journal November 1986
Diffusion barrier property of TiN and TiN/Al/TiN films deposited with FMCVD for Cu interconnection in ULSI journal January 2004
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Plasma enhanced magnetron sputter deposition of Ti–Si–C–N based nanocomposite coatings journal December 2008
Oxidation Behavior of Aluminum Nitride Thin Films on Superalloy Substrates journal January 2004