Atomic Layer Deposition of Ultrathin TaN and Ternary Ta[subscript 1-X]Al[subscript X]N[subscript y] Films for Cu Diffusion Barrier Applications in Advanced Interconnects
- Research Organization:
- Argonne National Lab. (ANL), Argonne, IL (United States). Advanced Photon Source (APS)
- Sponsoring Organization:
- DOE - BASIC ENERGY SCIENCES
- OSTI ID:
- 1240180
- Journal Information:
- ECS Transactions, Vol. 69, Issue (7) ; 2015; ISSN 1938-5862
- Country of Publication:
- United States
- Language:
- ENGLISH
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