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Title: Non-permeable substrate carrier for electroplating

Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Inventors:
; ; ; ; ; ; ;
Publication Date:
Research Org.:
SunPower Corporation, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1234229
Patent Number(s):
9,222,193
Application Number:
13/661,966
Assignee:
SunPower Corporation GFO
DOE Contract Number:
FC36-07GO17043
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Oct 26
Country of Publication:
United States
Language:
English
Subject:
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY; 36 MATERIALS SCIENCE

Citation Formats

Abas, Emmanuel Chua, Chen, Chen-an, Ma, Diana Xiaobing, Ganti, Kalyana, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., and Castillo, Arnold Villamor. Non-permeable substrate carrier for electroplating. United States: N. p., 2015. Web.
Abas, Emmanuel Chua, Chen, Chen-an, Ma, Diana Xiaobing, Ganti, Kalyana, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., & Castillo, Arnold Villamor. Non-permeable substrate carrier for electroplating. United States.
Abas, Emmanuel Chua, Chen, Chen-an, Ma, Diana Xiaobing, Ganti, Kalyana, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., and Castillo, Arnold Villamor. Tue . "Non-permeable substrate carrier for electroplating". United States. doi:. https://www.osti.gov/servlets/purl/1234229.
@article{osti_1234229,
title = {Non-permeable substrate carrier for electroplating},
author = {Abas, Emmanuel Chua and Chen, Chen-an and Ma, Diana Xiaobing and Ganti, Kalyana and Divino, Edmundo Anida and Ermita, Jake Randal G. and Capulong, Jose Francisco S. and Castillo, Arnold Villamor},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 29 00:00:00 EST 2015},
month = {Tue Dec 29 00:00:00 EST 2015}
}

Patent:

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  • One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features aremore » also disclosed.« less
  • One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.
  • One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
  • One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.
  • Metals such as lead, silver, copper, calcium, antimony, cadmium, nickel and zinc are electroplated onto a film-forming metal substrate from the group of aluminium, titanium, zirconium, niobium, molybdenum, tungsten, tantalum and alloys thereof, using an etching/electroplating solution comprising ions of the metal(s) to be plated, optionally alkali metal ions, aluminium halide and an aromatic hydrocarbon. Surface oxide is removed from the film-forming metal substrate by reaction with the aluminium halide and the metal(s) in solution to form soluble complexes, this possibly being assisted by anodization. This is followed by cathodically connecting the substrate and passing current to electroplate the metal(s)more » onto the oxide-free surface, directly in the same etching/electroplating solution.« less