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Title: Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors

Authors:
; ; ; ; ; ; ; ; ;
Publication Date:
Research Org.:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1229328
Report Number(s):
BNL-111403-2015-JA
Journal ID: ISSN 0018-9499
DOE Contract Number:  
SC00112704
Resource Type:
Journal Article
Resource Relation:
Journal Name: IEEE Transactions on Nuclear Science; Journal Volume: 62; Journal Issue: 1
Country of Publication:
United States
Language:
English

Citation Formats

Deptuch, G, Carini, G, Collier, T, Grybos, P, Kmon, P, Lipton, R, Maj, P, Siddons, D, Szczygiel, R, and Yarema, R. Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors. United States: N. p., 2015. Web. doi:10.1109/TNS.2014.2378784.
Deptuch, G, Carini, G, Collier, T, Grybos, P, Kmon, P, Lipton, R, Maj, P, Siddons, D, Szczygiel, R, & Yarema, R. Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors. United States. doi:10.1109/TNS.2014.2378784.
Deptuch, G, Carini, G, Collier, T, Grybos, P, Kmon, P, Lipton, R, Maj, P, Siddons, D, Szczygiel, R, and Yarema, R. Thu . "Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors". United States. doi:10.1109/TNS.2014.2378784.
@article{osti_1229328,
title = {Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors},
author = {Deptuch, G and Carini, G and Collier, T and Grybos, P and Kmon, P and Lipton, R and Maj, P and Siddons, D and Szczygiel, R and Yarema, R},
abstractNote = {},
doi = {10.1109/TNS.2014.2378784},
journal = {IEEE Transactions on Nuclear Science},
number = 1,
volume = 62,
place = {United States},
year = {Thu Jan 01 00:00:00 EST 2015},
month = {Thu Jan 01 00:00:00 EST 2015}
}