Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction

Elmer, John W.; Specht, Eliot D.

doi:10.1007/s11664-010-1438-3

Title: Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction

Journal Article · Wed Dec 15 00:00:00 EST 2010 · Journal of Electronic Materials

DOI:https://doi.org/10.1007/s11664-010-1438-3· OSTI ID:1226957

Elmer, John W. ^[1]; Specht, Eliot D. ^[2]

Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

The solidification behavior of two low-melting-point metals, Sn and In, on three substrates has been examined using in situ x-ray diffraction. Undercoolings of up to 56.1°C were observed for Sn solidified on graphite, which is a non-wetting substrate, while lower undercoolings were observed for Sn on Au/Ni/Cu (17.3°C) and on Cu (10.5°C). Indium behaved quite differently, showing undercoolings of less than 4°C on all three substrates. The lattice expansion/contraction behavior of Sn, In, and intermetallic compounds (IMCs) that formed during the reaction of Sn with Au/Ni/Cu surfaces were also measured during heating and cooling. Results showed anisotropic and nonlinear expansion of both Sn and In, with a contraction, rather than expansion, of the basal planes of In during heating. The principal IMC that formed between Sn and the Au/Ni/Cu surface was characterized as Cu₆Sn₅, having an average expansion coefficient of 13.6 × 10^₋6/°C, which is less than that of Sn or Cu.

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Research Organization:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: AC52-07NA27344; AC05- 00OR22725; W-31-109-ENG-38

OSTI ID:: 1226957

Report Number(s):: LLNL-JRNL-435591

Journal Information:: Journal of Electronic Materials, Vol. 40, Issue 2; ISSN 0361-5235

Publisher:: SpringerCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 9 works

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